Corrective Assignment to Correct the First Inventor Name Previously Recorded at Reel: 048219 Frame: 0582. Assignor(S) Hereby Confirms the Assignment .

Recorded: 2022-04-13 Pages: 9

Assignors

LIU, HAO CHUN

Executed: 2022-04-11

HSIAO, CHING-WEN

Executed: 2022-04-12

HSU, KUO-CHING

Executed: 2022-04-12

LII, MIRNG-JI

Executed: 2022-04-12

Assignee

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN

Covered Property (1)

Bonding Structures in Semiconductor Packaged Device and Method of Forming Same

Patent: 11,393,771 →

Application: 16/265,136 →

Publication: US 2020/0105682

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.