Patent Assignment
Reel/Frame 048221/0860
Assignment of Assignor's Interest
Recorded: 2019-02-01
Pages: 3
Assignor
LU, WEN-LONG
Executed: 2019-01-30
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same