Patent Assignment
Reel/Frame 048228/0409
Assignment of Assignor's Interest
Recorded: 2019-02-04
Pages: 5
Assignors
CHIANG, TSUNG-HSIEN
Executed: 2018-12-11
HUANG, YU-CHIH
Executed: 2018-12-11
KUO, TING-TING
Executed: 2018-12-11
TAI, CHIH-HSUAN
Executed: 2018-12-10
WU, BAN-LI
Executed: 2018-12-11
TSENG, YING-CHENG
Executed: 2018-12-11
LAI, CHI-HUI
Executed: 2018-12-11
LIU, CHIAHUNG
Executed: 2018-12-24
TSAI, HAO-YI
Executed: 2018-12-24
LIU, CHUNG-SHI
Executed: 2018-12-21
YU, CHEN-HUA
Executed: 2018-12-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Sensor Package and Method