IP Library Assignment 048257/0502
Patent Assignment
Reel/Frame 048257/0502

Assignment of Assignor's Interest

Recorded: 2019-02-06 Pages: 3
Assignors
ZHANG, JAMES
Executed: 2018-10-23
XU, YI
Executed: 2018-10-23
CAI, YUHONG
Executed: 2018-10-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Solder Mask Design for Delamination Prevention
Application: 16/177,046 →
Publication: US 2020/0135602
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072850/0834 →