Patent Assignment
Reel/Frame 072850/0834
Assignment of Assignor's Interest
Recorded: 2025-09-17
Pages: 70
Assignor
INTEL CORPORATION
Executed: 2025-08-19
Assignee
SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
10951 WHITE ROCK ROAD, RANCHO CORDOVA, CALIFORNIA, 95670
Covered Properties
(25)
Technologies for Adjusting the Performance of Data Storage Devices Based on Telemetry Data
Technologies for Computational Storage via Offload Kernel Extensions
Technologies for Logging and Visualizing Storage Events
Solderless Bga Interconnect
Reciprocal Pcb Manufacturing Process
Electronic Package and Method of Forming an Electronic Package
Bowl Shaped Pad
Semiconductor Package Design for Solder Joint Reliability
Pad Design for Thermal Fatigue Resistance and Interconnect Joint Reliability
Dual Head Capillary Design for Vertical Wire Bond
Solder Mask Design for Delamination Prevention
Offload of Data Lookup Operations
Storage Compute Offloads on Sharded and Erasure-Coded Data
Securely Providing Multiple Wake-Up Time Options for Pci Express
Diode for Use in Testing Semiconductor Packages
System in Package with Interconnected Modules
Temporary Interconnect for Use in Testing a Semiconductor Package
Dual Mode Snap Back Circuit Device
Technology For Fine-Grain Encryption And Secure Key Injection On Self-Encrypting Drives
Bypassing Cache Memory in a Write Transaction in a System with Multi-Level Memory
Integrated Circuit Packages with Asymmetric Adhesion Material Regions
Vented Lids for Integrated Circuit Packages
Data Consistency and Durability Over Distributed Persistent Memory Systems
Interconnect Structure Fabricated Using Lithographic and Deposition Processes
Film in Substrate for Releasing Z Stack-Up Constraint
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 11, 2018
From: TARANGO, JOSEPH DAVID; BACA, JIM
To: INTEL CORPORATION
Reel/Frame 046834/0150 →
Assignment of Assignor's Interest
Sep 26, 2018
From: TRIKA, SANJEEV
To: INTEL CORPORATION
Reel/Frame 046978/0049 →
Assignment of Assignor's Interest
Oct 29, 2018
From: TRIKA, SANJEEV
To: INTEL CORPORATION
Reel/Frame 047338/0974 →
Assignment of Assignor's Interest
Dec 31, 2018
From: WANG, REN; HERDRICH, ANDREW J.; TAI, TSUNG-YUAN C.; WANG, YIPENG
To: INTEL CORPORATION
Reel/Frame 047876/0928 →
Assignment of Assignor's Interest
Jan 14, 2019
From: TRIKA, SANJEEV N.; MILLER, STEVEN C.
To: INTEL CORPORATION
Reel/Frame 047988/0074 →
Assignment of Assignor's Interest
Feb 6, 2019
From: PON, FLORENCE; LEUTEN, TYLER; RAMISO, MARIA ANGELA DAMILLE
To: INTEL CORPORATION
Reel/Frame 048256/0491 →
Assignment of Assignor's Interest
Feb 6, 2019
From: LEUTEN, TYLER; RAHMAN, MOHAMMED; KHALAF, BILAL
To: INTEL CORPORATION
Reel/Frame 048248/0488 →
Assignment of Assignor's Interest
Feb 6, 2019
From: LEUTEN, TYLER
To: INTEL CORPORATION
Reel/Frame 048249/0494 →
Assignment of Assignor's Interest
Feb 6, 2019
From: CAI, YUHONG; GOGINENI, SIREESHA; XU, YI
To: INTEL CORPORATION
Reel/Frame 048256/0975 →
Assignment of Assignor's Interest
Feb 6, 2019
From: CAI, YUHONG; XU, YI
To: INTEL CORPORATION
Reel/Frame 048257/0307 →
Assignment of Assignor's Interest
Feb 6, 2019
From: ZHANG, JAMES; XU, YI; CAI, YUHONG
To: INTEL CORPORATION
Reel/Frame 048257/0502 →
Assignment of Assignor's Interest
Feb 7, 2019
From: CAI, YUHONG; KHALAF, BILAL; XU, YI
To: INTEL CORPORATION
Reel/Frame 048271/0829 →
Assignment of Assignor's Interest
Feb 20, 2019
From: GOGINENI, SIREESHA; XU, YI; CAI, YUHONG
To: INTEL CORPORATION
Reel/Frame 048383/0160 →
Assignment of Assignor's Interest
Feb 21, 2019
From: XU, YI; KIM, HYOUNG IL; PON, FLORENCE
To: INTEL CORPORATION
Reel/Frame 048402/0600 →
Assignment of Assignor's Interest
Mar 5, 2019
From: LI, ANG; TAN, KUAN HUA; OOI, ENG HUN
To: INTEL CORPORATION
Reel/Frame 048504/0401 →
Assignment of Assignor's Interest
Nov 15, 2019
From: KIM, HYOUNG IL; XU, YI; PON, FLORENCE
To: INTEL CORPORATION
Reel/Frame 051040/0573 →
Assignment of Assignor's Interest
Nov 15, 2019
From: KIM, HYOUNG IL; KHALAF, BILAL; DOMINGUEZ, JUAN E.; MEYERS, JOHN G.
To: INTEL CORPORATION
Reel/Frame 051025/0134 →