Patent Assignment
Reel/Frame 048383/0160
Assignment of Assignor's Interest
Recorded: 2019-02-20
Pages: 3
Assignors
GOGINENI, SIREESHA
Executed: 2018-10-09
XU, YI
Executed: 2018-10-09
CAI, YUHONG
Executed: 2018-10-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Pad Design for Thermal Fatigue Resistance and Interconnect Joint Reliability
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.