Dual head capillary design for vertical wire bond
Embodiments disclosed herein include wire bonds and tools for forming wire bonds. In an embodiment, a wire bond may comprise a first attachment ball, and a first wire having a first portion contacting the first attachment ball and a second portion. In an embodiment, the wire bond may further comprise a second attachment ball, and a second wire having a first portion contacting the second attachment ball and a second portion. In an embodiment, the second portion of the first wire is connected to the second portion of the second wire.
1. A wire bond, comprising:
a first attachment ball attached to a first surface of a first substrate;
a first wire having a first portion contacting the first attachment ball and a second portion, the first wire having a sidewall between first and second opposite ends;
a second attachment ball attached to a first surface of a second substrate, the first surface of the second substrate having a face-to-face orientation with the first surface of the first substrate; and
a second wire having a first portion contacting the second attachment ball and a second portion, the second wire having a sidewall between first and second opposite ends, wherein the sidewall of the second portion of the first wire vertically overlaps with and is connected to and in direct physical contact with the sidewall of the second portion of the second wire.
2. The wire bond of claim 1 , wherein the first wire and the second wire are substantially equal in length.
3. The wire bond of claim 1 , wherein the first attachment ball is aligned with the second attachment ball.
4. The wire bond of claim 1 , wherein the first attachment ball is not aligned with the second attachment ball.
5. The wire bond of claim 4 , wherein the first wire is a different length than the second wire.
6. The wire bond of claim 1 , wherein the first attachment ball is coupled to a first substrate.
7. The wire bond of claim 6 , wherein the second attachment ball is coupled to a second substrate.
8. The wire bond of claim 7 , wherein the first substrate is oriented face-to-face with respect to the second substrate.
9. The wire bond of claim 7 , wherein the first substrate is a die and wherein the second substrate is a package substrate.
10. The wire bond of claim 7 , wherein the first substrate is a die and wherein the second substrate is a die.