IP Library Assignment 048271/0829
Patent Assignment
Reel/Frame 048271/0829

Assignment of Assignor's Interest

Recorded: 2019-02-07 Pages: 3
Assignors
CAI, YUHONG
Executed: 2018-10-10
KHALAF, BILAL
Executed: 2018-10-10
XU, YI
Executed: 2018-10-10
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Dual Head Capillary Design for Vertical Wire Bond
Application: 16/160,212 →
Publication: US 2020/0118961
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072850/0834 →