Patent Assignment
Reel/Frame 048257/0307
Assignment of Assignor's Interest
Recorded: 2019-02-06
Pages: 3
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Semiconductor Package Design for Solder Joint Reliability
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.