IP Library Assignment 048274/0347
Patent Assignment
Reel/Frame 048274/0347

Assignment of Assignor's Interest

Recorded: 2019-02-08 Pages: 2
Assignors
HO, LIN-CHEN
Executed: 2017-05-02
TSAI, WEI-WEN
Executed: 2017-05-02
LEE, CHENG-PING
Executed: 2017-05-02
Assignee
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
451 BELLEVUE ROAD, NEWARK, DELAWARE, 19713
Covered Property (1)
Chemical Mechanical Polishing of Tungsten Using a Method and Composition Containing Quaternary Phosphonium Compounds
Application: 16/270,725 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →