Patent Assignment
Reel/Frame 048276/0415
Assignment of Assignor's Interest
Recorded: 2019-02-08
Pages: 8
Assignors
DHANE, KEDAR
Executed: 2018-12-19
ANTONISWAMY, ARAVINDHA R.
Executed: 2018-12-19
KARHADE, OMKAR
Executed: 2018-12-18
MANI, DIVYA
Executed: 2018-12-21
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Liquid Thermal Interface Material in Electronic Packaging