Liquid thermal interface material in electronic packaging
An integrated circuit package that includes a liquid phase thermal interface material (TIM) is described. The package may include any number of die. The liquid phase TIM can be sealed in a chamber between a die and an integrated heat spreader and bounded on the sides by a perimeter layer. The liquid phase TIM can be fixed in place or circulated, depending on application. A thermal conductivity of the liquid phase TIM can be at least 15 Watts/meter-Kelvin, according to some embodiments. A liquid phase TIM eliminates failure mechanisms present in solid phase TIMs, such as cracking due to warpage and uncontained flow out of the module.
1. An integrated circuit package comprising:
a substrate;
a die, comprising a first surface and a second surface opposite the first surface, the first surface facing a surface of the substrate, the die having a perimeter defined by a width and a length;
a layer comprising a polymer, the layer at least between the substrate and the die, the layer including a portion extending beyond the perimeter of the die and having a height up to at least the second surface of the die;
a heat spreader comprising a thermally conductive material, the heat spreader including a top plate, wherein the top plate and layer at least partly define a chamber above the second surface of the die;
a second layer comprising a polymer that forms side walls of the chamber, wherein the side walls are horizontally aligned at the portion of the layer; and
a material comprising a liquid phase thermally conductive material within the chamber.
2. The integrated circuit package of claim 1 , wherein the portion of the layer comprising polymer extends at least 100 microns beyond the perimeter of the die.
3. The integrated circuit package of claim 1 , wherein a top surface of the layer comprising polymer is coplanar with the second surface of the die.
4. The integrated circuit package of claim 1 , wherein the heat spreader is in thermal contact with the die by way of a eutectic alloy comprising one or more of bismuth (Bi), lead (Pb), tin (Sn), cadmium (Cd), antimony (Sb), indium (In), thallium (Tl), tellurium (Te), selenium (Se), gallium (Ga), and/or mercury (Hg).
5. The integrated circuit package of claim 1 , wherein the heat spreader is in thermal contact with the die by way of an eutectic alloy comprising 62 weight (wt.) % to 95 wt. % gallium, 5 wt. % to 22 wt. % indium, and 0 wt. % to 16 wt. % tin, with a sum of weight percentages totaling 100 wt. %.
6. The integrated circuit package of claim 5 , wherein the eutectic alloy has a thermal conductivity of at least 16 Watts/meter-Kelvin and a eutectic transition temperature of less than 11° C.
7. The integrated circuit package of claim 1 , wherein the material comprising the liquid phase thermally conductive material has a thermal conductivity of at least 15 Watts/meter-Kelvin.
8. The integrated circuit package of claim 1 , wherein the top plate of the heat spreader defines a first hole and a second hole.
9. The integrated circuit package of claim 8 , wherein one or both of the first hole and the second hole are filled with a polymer.
10. The integrated circuit package of claim 8 , wherein the first hole and the second hole are filled with a solder.
11. A motherboard comprising the integrated circuit package of claim 1 .
12. A computing device comprising the integrated circuit package of claim 1 .
13. An integrated circuit package comprising:
a substrate;
a die, comprising a first surface and a second surface opposite the first surface, the first surface facing a surface of the substrate, the die having a perimeter defined by a width and a length;
a layer comprising a polymer, the layer at least between the substrate and the die, the layer including a portion extending beyond the perimeter of the die wherein the layer comprising polymer is a first layer and the portion extends vertically up to at least the second surface of the die;
a heat spreader comprising a thermally conductive material, the heat spreader including a top plate, wherein the top plate and layer at least partly define a chamber above the second surface of the die; and
a second layer comprising a polymer over the portion of the first layer and between the portion of the first layer and the heat spreader to form side walls of the chamber, wherein an entirety of the second layer is above the second surface of the die.
14. The integrated circuit package of claim 13 , further comprising a material comprising a liquid phase thermally conductive material within the chamber.
15. The integrated circuit package of claim 14 , wherein the liquid phase thermally conductive material is a eutectic alloy having a eutectic transition temperature of less than 20° C.
16. The integrated circuit package of claim 13 , wherein the heat spreader is in thermal contact with the second layer.
17. The integrated circuit package of claim 13 , wherein the chamber has a height of at least 10 μm from the second surface of the die to an underside of the top plate of the heat spreader.
18. An integrated circuit package comprising:
a substrate; a die, comprising a first surface and a second surface opposite the first surface, the first surface facing a surface of the substrate, the die having a perimeter defined by a width and a length;
a layer comprising a polymer, the layer at least between the substrate and the die, the layer including a portion extending beyond the perimeter of the die;
a heat spreader comprising a thermally conductive material, the heat spreader including a top plate, wherein the top plate and layer at least partly define a chamber above the second surface of the die wherein the top plate of the heat spreader defines a first hole and a second hole; a material comprising a liquid phase thermally conductive material within the chamber; and
a circulation system comprising a pump, an input conduit, and an output conduit, wherein the input conduit is connected to the first hole and the output conduit is connected to the second hole, wherein the circulation system is configured to pump the liquid phase thermally conductive material through the chamber from the first hole to the second hole.
19. The integrated circuit package of claim 18 , wherein the chamber has a height of at least 100 μm from the second surface of the die to an underside of the top plate of the heat spreader.
20. The integrated circuit package of claim 18 , further comprising a heat exchanger.