IP Library › Assignment 048290/0652
Patent Assignment
Reel/Frame 048290/0652

Assignment of Assignor's Interest

Recorded: 2019-02-08 Pages: 6
Assignors
GUO, SONG
Executed: 2018-12-21
SUN, JIANQI
Executed: 2018-12-21
CHEN, FEIBIAO
Executed: 2018-12-21
ZHU, YUEBIN
Executed: 2018-12-21
WANG, TIANMING
Executed: 2018-12-21
XIA, HAI
Executed: 2018-12-21
Assignee
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
1525 ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH PARK, SHANGHAI, 201023, CHINA
Covered Property (1)
A Chip Bonding Device and Bonding Method Thereof
Application: 16/312,834 →
Publication: US 2019/0164930
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
To: AMIES TECHNOLOGY CO., LTD.
Reel/Frame 072912/0466 →