IP Library › Assignment 048346/0033
Patent Assignment
Reel/Frame 048346/0033

Assignment of Assignor's Interest

Recorded: 2019-02-15 Pages: 4
Assignors
TANG, LAI GUAN
Executed: 2019-02-11
NALAMALPU, ANKIREDDY
Executed: 2019-02-11
SUBBAREDDY, DHEERAJ
Executed: 2019-02-11
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
High-Speed Core Interconnect for Multi-Die Programmable Logic Devices
Application: 16/236,062 →
Publication: US 2019/0140649
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 19, 2024
From: INTEL CORPORATION
To: ALTERA CORPORATION
Reel/Frame 066353/0886 →
Security Interest Sep 12, 2025
From: ALTERA CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 073431/0309 →