IP Library › Assignment 048366/0482
Patent Assignment
Reel/Frame 048366/0482

Assignment of Assignor's Interest

Recorded: 2019-02-19 Pages: 4
Assignors
ZHU, ZHI
Executed: 2019-01-24
ZHAO, JIANJUN
Executed: 2019-01-24
HUO, ZHIJUN
Executed: 2019-01-24
Assignee
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
1525 ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH PARK, SHANGHAI, 201203, CHINA
Covered Property (1)
Device and Method for Bonding Alignment
Application: 16/321,702 →
Publication: US 2020/0090962
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
To: AMIES TECHNOLOGY CO., LTD.
Reel/Frame 072912/0466 →