IP Library Assignment 048374/0181
Patent Assignment
Reel/Frame 048374/0181

Assignment of Assignor's Interest

Recorded: 2019-02-19 Pages: 11
Assignors
CHIANG, TSU-WU
Executed: 2015-03-23
WESTERMAN, RUSSELL
Executed: 2018-04-26
Assignee
PLASMA-THERM, LLC
10050 16TH STREET NORTH, ST. PETERSBURG, FLORIDA, 33716
Covered Property (1)
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Application: 16/279,560 →
Publication: US 2019/0189513
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058899/0658 →
Security Interest Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058945/0169 →
Security Interest Jun 28, 2022
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; HINE AUTOMATION, LLC
To: VALLEY NATIONAL BANK
Reel/Frame 060447/0766 →
Release of Security Interest Aug 3, 2022
From: HSBC BANK USA, N.A.
To: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; PLASMA-THERM IC-DISC, INC.; PLASMA-THERM NES, LLC
Reel/Frame 061070/0642 →