Patent Assignment
Reel/Frame 061070/0642
Release of Security Interest
Recorded: 2022-08-03
Pages: 14
Assignor
HSBC BANK USA, N.A.
Executed: 2022-08-01
Assignees
RAJE TECHNOLOGY GROUP, LLC
10050 16TH ST N, ST. PETERSBURG, FLORIDA, 33716
PLASMA-THERM, LLC
10050 16TH ST N, ST. PETERSBURG, FLORIDA, 33716
PLASMA-THERM IC-DISC, INC.
10050 16TH ST N, ST. PETERSBURG, FLORIDA, 33716
PLASMA-THERM NES, LLC
10050 16TH ST N, ST. PETERSBURG, FLORIDA, 33716
REV-TECH MANUFACTURING SOLUTIONS, LLC
9900 18TH ST N, STE 105, ST. PETERSBURG, FLORIDA, 33716
HINE AUTOMATION, LLC
12495 34TH ST N, STE B, ST. PETERSBURG, FLORIDA, 33716
DRYTEK LLC
9900 18TH ST N, STE 105, ST. PETERSBURG, FLORIDA, 33716
LOGIX TECHNOLOGY HOLDINGS, LLC
10460 ROOSEVELT BOULEVARD N, PMB 101, ST. PETERSBURG, FLORIDA, 33716
Covered Properties
(61)
Etching Process for Producing Substantially Undercut Free Silicon on Insulator Structures
Patent:
6,071,822 →
Application:
09/127,762 →
Morphed Processing of Semiconductor Devices
Patent:
6,417,013 →
Application:
09/239,723 →
Magnetic Pole Fabrication Process and Device
Patent:
6,540,928 →
Application:
09/658,023 →
Magnetic Pole Fabrication Process and Device
Patent:
6,547,975 →
Application:
09/696,739 →
Method for Thin Film Lift-Off Processes Using Lateral Extended Etching Masks and Device
Embedded Attenuated Phase Shift Mask and Method of Making Embedded Attenuated Phase Shift Mask
Perimeter Seal for Backside Cooling of Substrates
Method for Etching Vias
Notch-Free Etching of High Aspect Soi Structures Using Alternating Deposition and Etching and Pulsed Plasma
Sidewall Smoothing in High Aspect Ratio/Deep Etching Using a Discrete Gas Switching Method
End Point Detection in Time Division Multiplexed Etch Processes
Method and Apparatus for Process Control in Time Division Multiplexed (Tdm) Etch Process
Etching of Chromium Layers on Photomasks Utilizing High Density Plasma and Low Frequency Rf Bias
Envelope Follower End Point Detection in Time Division Multiplexed Processes
Method and Apparatus for Process Control in Time Division Multiplexed (Tdm) Etch Processes
Method and Apparatus for Reducing Aspect Ratio Dependent Etching in Time Division Multiplexed Etch Processes
Method & Apparatus to Improve Plasma Etch Uniformity
Process Change Detection Through the Use of Evolutionary Algorithms
Optical Emission Interferometry for Pecvd Using a Gas Injection Hole
Method for Etching Photolithographic Substrates
Temperature Control Method for Photolithographic Substrate
Method for Plasma Etching of Positively Sloped Structures
Method to Minimize Cd Etch Bias
Grid Assemblies for Use in Ion Beam Etching Systems and Methods of Utilizing the Grid Assemblies
Patent:
8,703,001 →
Application:
12/244,681 →
Conductive Seal Ring Electrostatic Chuck
Device and Process for Chemical Vapor Phase Treatment
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method for Dicing a Substrate with Back Metal
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Wafer Stage for Symmetric Wafer Processing
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Chemical Vapor Deposition Device
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Patent:
46,339 →
Application:
14/854,127 →
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method for Dicing a Substrate with Back Metal
Powered Anode for Ion Source for Dlc and Reactive Processes
Patent:
9,865,436 →
Application:
15/206,300 →
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method for Removing a Metal Deposit Placed on a Surface in a Chamber
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Device for Treating an Object with Plasma
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method for Removing a Metal Deposit Arranged on a Surface in a Chamber
Method for Producing an Interconnection Comprising a via Extending Through a Substrate
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method for Dicing Die Attach Film
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 20, 1998
From: DONOHUE, JOHN F.; JOHNSON, DAVID J.; DEVRE, MICHAEL W.
To: PLASMA-THERM, INC.
Reel/Frame 009527/0937 →
Assignment of Assignor's Interest
Apr 12, 1999
From: TEIXEIRA, MICHAEL J.; DEVRE, MIKE; DAWSON, WADE; JOHNSON, DAVE
To: PLASMA-THERM, INC.
Reel/Frame 009881/0423 →
Assignment of Assignor's Interest
Jan 18, 2001
From: KOBRIN, BORIS; OSTAN, EDWARD
To: UNAXIS USA INC.
Reel/Frame 011451/0844 →
Assignment of Assignor's Interest
Feb 20, 2001
From: KOBRIN, BORIS
To: UNAXIS USA INC.
Reel/Frame 011544/0260 →
Assignment of Assignor's Interest
May 2, 2001
From: LISHAN, DAVID G.
To: UNAXIS USA
Reel/Frame 011780/0322 →
Assignment of Assignor's Interest
Nov 30, 2001
From: WESTERMAN, RUSSELL; CONSTANTINE, CHRISTOPHER
To: UNAXIS USA INC.
Reel/Frame 012339/0494 →
Assignment of Assignor's Interest
Jun 6, 2002
From: KENNEY, MARK D.
To: UNAXIS USA, INC.
Reel/Frame 012978/0139 →
Assignment of Assignor's Interest
Jun 24, 2004
From: WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015498/0852 →
Assignment of Assignor's Interest
Jul 22, 2004
From: LAI, SHOULIANG; WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015595/0802 →
Assignment of Assignor's Interest
Jul 28, 2004
From: WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015626/0938 →
Assignment of Assignor's Interest
Aug 17, 2004
From: CONSTANTINE, CHRISTOPHER; PLUMHOFF, JASON; WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015691/0069 →
Assignment of Assignor's Interest
Aug 16, 2005
From: JOHNSON, DAVID; WESTERMAN, RUSSELL; TEIXEIRA, MICHAEL J.; LAI, SHOULIANG
To: UNAXIS USA INC.
Reel/Frame 016405/0085 →
Assignment of Assignor's Interest
Sep 21, 2005
From: JOHNSON, DAVID; WESTERMAN, RUSSELL; LAI, SHOULIANG
To: UNAXIS USA INC.
Reel/Frame 016566/0040 →
Assignment of Assignor's Interest
Jan 26, 2006
From: JOHNSON, DAVID; WESTERMAN, RUSSELL
To: UNAXIS USA INC.
Reel/Frame 017068/0902 →
Assignment of Assignor's Interest
Jul 12, 2006
From: PLUMHOFF, JASON
To: UNAXIS USA INC.
Reel/Frame 017920/0419 →
Assignment of Assignor's Interest
Sep 6, 2006
From: PLUMHOFF, JASON
To: UNAXIS USA INC.
Reel/Frame 018210/0643 →
Assignment of Assignor's Interest
Feb 5, 2009
From: OERLIKON USA, INC.
To: PLASMA-THERM, LLC
Reel/Frame 022203/0740 →
Assignment of Assignor's Interest
Apr 2, 2013
From: OERLIKON USA INC.
To: PLASMA-THERM, LLC
Reel/Frame 030134/0245 →
Security Agreement
Apr 5, 2013
From: PLASMA-THERM, LLC
To: TD BANK, N.A.
Reel/Frame 030157/0772 →
Security Interest
Apr 28, 2015
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
To: SUNTRUST BANK
Reel/Frame 035509/0738 →
Release of Security Interest
Jul 30, 2015
From: TD BANK, N.A.
To: PLASMA-THERM, LLC
Reel/Frame 036221/0402 →
Security Interest
Sep 13, 2016
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
To: SUNTRUST BANK
Reel/Frame 039706/0927 →
Release of Security Interest
Nov 28, 2018
From: SUNTRUST BANK
To: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
Reel/Frame 047608/0189 →
Security Interest
Nov 29, 2018
From: HINE AUTOMATION, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047687/0357 →
Security Interest
Nov 29, 2018
From: DRYTEK, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048174/0001 →