IP Library › Assignment 047608/0189
Patent Assignment
Reel/Frame 047608/0189

Release of Security Interest

Recorded: 2018-11-28 Pages: 17
Assignor
SUNTRUST BANK
Executed: 2018-11-21
Assignees
RAJE TECHNOLOGY GROUP, LLC
10050 16TH STREET NORTH, ST. PETERSBURG, FLORIDA, 33716
PLASMA-THERM, LLC
10050 16TH STREET NORTH, ST. PETERSBURG, FLORIDA, 33716
REV-TECH MANUFACTURING SOLUTIONS, LLC
9900 18TH STREET, ST. PETERSBURG, FLORIDA, 33716
LOGIX TECHNOLOGY HOLDINGS, LLC
10460 ROOSEVELT BOULEVARD NORTH, PMB 101, ST. PETERSBURG, FLORIDA, 33716
PLASMA-THERM IC-DISC, INC.
10050 16TH STREET NORTH, ST. PETERSBURG, FLORIDA, 33716
DRYTEK, LLC
9900 18TH STREET, ST. PETERSBURG, FLORIDA, 33716
Covered Properties (31)
Etching Process for Producing Substantially Undercut Free Silicon on Insulator Structures
Patent: 6,071,822 →
Application: 09/127,762 →
Morphed Processing of Semiconductor Devices
Patent: 6,417,013 →
Application: 09/239,723 →
Magnetic Pole Fabrication Process and Device
Patent: 6,540,928 →
Application: 09/658,023 →
Magnetic Pole Fabrication Process and Device
Patent: 6,547,975 →
Application: 09/696,739 →
Method for Thin Film Lift-Off Processes Using Lateral Extended Etching Masks and Device
Patent: 6,605,519 →
Application: 09/846,214 →
Publication: US 2002/0164884
Embedded Attenuated Phase Shift Mask and Method of Making Embedded Attenuated Phase Shift Mask
Patent: 6,544,696 →
Application: 09/996,748 →
Publication: US 2002/0068229
Perimeter Seal for Backside Cooling of Substrates
Patent: 6,771,482 →
Application: 10/163,567 →
Publication: US 2003/0021077
Method for Etching Vias
Patent: 6,846,747 →
Application: 10/407,831 →
Publication: US 2003/0216034
Notch-Free Etching of High Aspect Soi Structures Using Alternating Deposition and Etching and Pulsed Plasma
Patent: 6,905,626 →
Application: 10/601,076 →
Publication: US 2004/0055995
Sidewall Smoothing in High Aspect Ratio/Deep Etching Using a Discrete Gas Switching Method
Patent: 6,924,235 →
Application: 10/640,469 →
Publication: US 2004/0092118
End Point Detection in Time Division Multiplexed Etch Processes
Patent: 6,982,175 →
Application: 10/770,839 →
Publication: US 2004/0175913
Method and Apparatus for Process Control in Time Division Multiplexed (Tdm) Etch Process
Patent: 7,115,520 →
Application: 10/815,965 →
Publication: US 2004/0235307
Etching of Chromium Layers on Photomasks Utilizing High Density Plasma and Low Frequency Rf Bias
Patent: 7,008,877 →
Application: 10/839,809 →
Publication: US 2004/0259367
Envelope Follower End Point Detection in Time Division Multiplexed Processes
Patent: 7,101,805 →
Application: 10/841,818 →
Publication: US 2004/0238489
Method and Apparatus for Process Control in Time Division Multiplexed (Tdm) Etch Processes
Patent: 7,381,650 →
Application: 11/155,904 →
Publication: US 2005/0263485
Method and Apparatus for Reducing Aspect Ratio Dependent Etching in Time Division Multiplexed Etch Processes
Patent: 7,959,819 →
Application: 11/159,415 →
Publication: US 2005/0287815
Method & Apparatus to Improve Plasma Etch Uniformity
Patent: 7,713,432 →
Application: 11/229,319 →
Publication: US 2006/0070703
Process Change Detection Through the Use of Evolutionary Algorithms
Patent: 7,625,824 →
Application: 11/441,811 →
Publication: US 2006/0287753
Optical Emission Interferometry for Pecvd Using a Gas Injection Hole
Patent: 7,833,381 →
Application: 11/502,585 →
Publication: US 2007/0039548
Method for Etching Photolithographic Substrates
Patent: 7,749,400 →
Application: 11/634,377 →
Publication: US 2007/0138136
Temperature Control Method for Photolithographic Substrate
Patent: 7,867,403 →
Application: 11/756,074 →
Publication: US 2008/0149597
Method for Plasma Etching of Positively Sloped Structures
Patent: 7,829,465 →
Application: 11/834,127 →
Publication: US 2008/0061029
Method to Minimize Cd Etch Bias
Patent: 8,187,483 →
Application: 11/834,299 →
Publication: US 2008/0035606
Conductive Seal Ring Electrostatic Chuck
Patent: 8,139,340 →
Application: 12/689,784 →
Publication: US 2011/0026187
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Patent: 8,802,545 →
Application: 13/412,119 →
Publication: US 2013/0065378
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Patent: 8,778,806 →
Application: 13/448,769 →
Publication: US 2012/0238073
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Patent: 8,796,154 →
Application: 13/764,110 →
Publication: US 2013/0230972
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Patent: 8,785,332 →
Application: 13/764,142 →
Publication: US 2013/0230968
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Patent: 8,980,764 →
Application: 13/764,160 →
Publication: US 2013/0230969
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Patent: 8,946,058 →
Application: 13/767,459 →
Publication: US 2013/0230973
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Patent: 8,691,702 →
Application: 13/829,324 →
Publication: US 2013/0230971
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 20, 1998
From: DONOHUE, JOHN F.; JOHNSON, DAVID J.; DEVRE, MICHAEL W.
To: PLASMA-THERM, INC.
Reel/Frame 009527/0937 →
Assignment of Assignor's Interest Apr 12, 1999
From: TEIXEIRA, MICHAEL J.; DEVRE, MIKE; DAWSON, WADE; JOHNSON, DAVE
To: PLASMA-THERM, INC.
Reel/Frame 009881/0423 →
Assignment of Assignor's Interest Jan 18, 2001
From: KOBRIN, BORIS; OSTAN, EDWARD
To: UNAXIS USA INC.
Reel/Frame 011451/0844 →
Assignment of Assignor's Interest Feb 20, 2001
From: KOBRIN, BORIS
To: UNAXIS USA INC.
Reel/Frame 011544/0260 →
Assignment of Assignor's Interest May 2, 2001
From: LISHAN, DAVID G.
To: UNAXIS USA
Reel/Frame 011780/0322 →
Assignment of Assignor's Interest Nov 30, 2001
From: WESTERMAN, RUSSELL; CONSTANTINE, CHRISTOPHER
To: UNAXIS USA INC.
Reel/Frame 012339/0494 →
Assignment of Assignor's Interest Jun 6, 2002
From: KENNEY, MARK D.
To: UNAXIS USA, INC.
Reel/Frame 012978/0139 →
Assignment of Assignor's Interest Jun 24, 2004
From: WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015498/0852 →
Assignment of Assignor's Interest Jul 22, 2004
From: LAI, SHOULIANG; WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015595/0802 →
Assignment of Assignor's Interest Jul 28, 2004
From: WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015626/0938 →
Assignment of Assignor's Interest Aug 17, 2004
From: CONSTANTINE, CHRISTOPHER; PLUMHOFF, JASON; WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015691/0069 →
Assignment of Assignor's Interest Aug 16, 2005
From: JOHNSON, DAVID; WESTERMAN, RUSSELL; TEIXEIRA, MICHAEL J.; LAI, SHOULIANG
To: UNAXIS USA INC.
Reel/Frame 016405/0085 →
Assignment of Assignor's Interest Sep 21, 2005
From: JOHNSON, DAVID; WESTERMAN, RUSSELL; LAI, SHOULIANG
To: UNAXIS USA INC.
Reel/Frame 016566/0040 →
Assignment of Assignor's Interest Jan 26, 2006
From: JOHNSON, DAVID; WESTERMAN, RUSSELL
To: UNAXIS USA INC.
Reel/Frame 017068/0902 →
Assignment of Assignor's Interest Jul 12, 2006
From: PLUMHOFF, JASON
To: UNAXIS USA INC.
Reel/Frame 017920/0419 →
Assignment of Assignor's Interest Sep 6, 2006
From: PLUMHOFF, JASON
To: UNAXIS USA INC.
Reel/Frame 018210/0643 →
Assignment of Assignor's Interest Feb 5, 2009
From: OERLIKON USA, INC.
To: PLASMA-THERM, LLC
Reel/Frame 022203/0740 →
Assignment of Assignor's Interest Apr 2, 2013
From: OERLIKON USA INC.
To: PLASMA-THERM, LLC
Reel/Frame 030134/0245 →
Security Agreement Apr 5, 2013
From: PLASMA-THERM, LLC
To: TD BANK, N.A.
Reel/Frame 030157/0772 →
Security Interest Apr 28, 2015
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
To: SUNTRUST BANK
Reel/Frame 035509/0738 →
Release of Security Interest Jul 30, 2015
From: TD BANK, N.A.
To: PLASMA-THERM, LLC
Reel/Frame 036221/0402 →
Security Interest Sep 13, 2016
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
To: SUNTRUST BANK
Reel/Frame 039706/0927 →
Security Interest Nov 29, 2018
From: HINE AUTOMATION, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047687/0357 →
Security Interest Nov 29, 2018
From: DRYTEK, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048174/0001 →
Security Interest Nov 29, 2018
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048173/0954 →