IP Library Granted Patent US 7,625,824
Granted Patent B2
US 7,625,824 · App. 11/441,811 · Granted Dec 1, 2009

Process change detection through the use of evolutionary algorithms

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,625,824
App. No.
11/441,811
Granted
Dec 1, 2009
Kind
B2
Abstract

The present invention provides a method for creating a process change detection algorithm. An evolutionary computing technique is applied to at least one process dataset containing at least one known process change. The evolutionary computing technique will generate a process state function (or a scaling coefficient set for use with an existing process state function) that optimizes detection of the known process changes. The generated process state function or coefficients can then be applied thereafter to future datasets (either in real-time or after processing) to detect process changes.

Claims (25)

1. A method for improving the detection of a process change, the method comprising:

placing a substrate in a chamber;

exposing the substrate to a process with at least one known process change;

acquiring at least one dataset during a process;

generating a first random population of process state functions;

applying at least one dataset to each member of the first generated population;

evaluating the ability of each member of the first generated population to detect at least one known process change;

recombining the most successful members of the first generated population to generate a second population;

applying at least one dataset to each member of the second generated population; and

evaluating the ability of each member of the second generated population to detect at least one known process change.

2. The method according to claim 1 wherein said process is a plasma etch process.

3. The method according to claim 1 wherein said substrate is a photomask.

4. The method according to claim 1 wherein said substrate is a semiconductor material.

5. The method according to claim 1 wherein said substrate is a dielectric material.

6. The method according to claim 1 wherein said substrate is an electrically conductive material.

7. The method according to claim 1 wherein said process change is a material transition in the substrate.

8. The method according to claim 1 wherein said dataset further comprising plasma emission spectra data.

9. The method according to claim 1 wherein said dataset further comprising residual gas analysis data.

10. The method according to claim 1 wherein said process state functions are a set of scaling coefficients.

11. The method according to claim 1 wherein said successful members are the top 20 percent of the population.

12. The method according to claim 11 wherein the remaining 80 percent of the population is eliminated from further consideration.

13. The method according to claim 1 further comprising a set number of generated populations.

14. The method according to claim 1 further comprising terminating the generation of populations when at least one member of a population meets a set criteria.

15. The method according to claim 1 wherein said dataset further comprising at least one plasma processing parameter.

16. The method according to claim 14 wherein said plasma processing parameter comprises measurements of the plasma condition, substrate condition, or processing apparatus condition.

Assignments (22)
RELEASE OF SECURITY INTEREST Recorded Aug 3, 2022
From: HSBC BANK USA, N.A.
To: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; PLASMA-THERM IC-DISC, INC.; PLASMA-THERM NES, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; HINE AUTOMATION, LLC; DRYTEK LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
Reel/Frame 061070/0642 →
SECURITY INTEREST Recorded Jun 28, 2022
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; HINE AUTOMATION, LLC; DRYTEK, LLC; PLASMA-THERM NES, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA THERM IC-DISC, INC.
To: VALLEY NATIONAL BANK
Reel/Frame 060447/0766 →
SECURITY INTEREST Recorded Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058899/0658 →
SECURITY INTEREST Recorded Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058945/0169 →
SECURITY INTEREST Recorded May 15, 2020
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM, NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 052679/0001 →
SECURITY INTEREST Recorded May 15, 2020
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 052679/0788 →
SECURITY INTEREST Recorded Nov 30, 2018
From: DRYTEK, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047688/0813 →
SECURITY INTEREST Recorded Nov 30, 2018
From: PLASMA-THERM IC-DISC, INC.; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047687/0418 →
SECURITY INTEREST Recorded Nov 30, 2018
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047688/0061 →
SECURITY INTEREST Recorded Nov 30, 2018
From: HINE AUTOMATION, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047688/0644 →
SECURITY INTEREST Recorded Nov 30, 2018
From: PLASMA-THERM IC-DISC, INC.; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047689/0098 →
SECURITY INTEREST Recorded Nov 29, 2018
From: HINE AUTOMATION, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047687/0357 →
SECURITY INTEREST Recorded Nov 29, 2018
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048173/0954 →
SECURITY INTEREST Recorded Nov 29, 2018
From: DRYTEK, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048174/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 28, 2018
From: SUNTRUST BANK
To: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM IC-DISC, INC.; DRYTEK, LLC
Reel/Frame 047608/0189 →
SECURITY INTEREST Recorded Sep 13, 2016
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM IC-DISC, INC.; DRYTEK, LLC; HINE AUTOMATION, LLC
To: SUNTRUST BANK
Reel/Frame 039706/0927 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2015
From: TD BANK, N.A.
To: PLASMA-THERM, LLC
Reel/Frame 036221/0402 →
SECURITY INTEREST Recorded Apr 28, 2015
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM IC-DISC, INC.; DRYTEK, LLC
To: SUNTRUST BANK
Reel/Frame 035509/0738 →
SECURITY AGREEMENT Recorded Apr 5, 2013
From: PLASMA-THERM, LLC
To: TD BANK, N.A.
Reel/Frame 030157/0772 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2009
From: OERLIKON USA, INC.
To: PLASMA-THERM, LLC
Reel/Frame 022203/0740 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2006
From: PLUMHOFF, JASON
To: UNAXIS USA INC.
Reel/Frame 018210/0643 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2006
From: PLUMHOFF, JASON
To: UNAXIS USA INC.
Reel/Frame 017920/0419 →