Patent Assignment
Reel/Frame 060447/0766
Security Interest
Recorded: 2022-06-28
Pages: 18
Assignors
RAJE TECHNOLOGY GROUP, LLC
Executed: 2022-06-02
PLASMA-THERM, LLC
Executed: 2022-06-02
REV-TECH MANUFACTURING SOLUTIONS, LLC
Executed: 2022-06-02
HINE AUTOMATION, LLC
Executed: 2022-06-02
DRYTEK, LLC
Executed: 2022-06-02
PLASMA-THERM NES, LLC
Executed: 2022-06-02
LOGIX TECHNOLOGY HOLDINGS, LLC
Executed: 2022-06-02
PLASMA THERM IC-DISC, INC.
Executed: 2022-06-02
Assignee
VALLEY NATIONAL BANK
1840 4TH STREET NORTH, ST. PETERSBURG, FLORIDA, 33704
Covered Properties
(59)
Embedded Attenuated Phase Shift Mask and Method of Making Embedded Attenuated Phase Shift Mask
Perimeter Seal for Backside Cooling of Substrates
Method for Etching Vias
Notch-Free Etching of High Aspect Soi Structures Using Alternating Deposition and Etching and Pulsed Plasma
Sidewall Smoothing in High Aspect Ratio/Deep Etching Using a Discrete Gas Switching Method
End Point Detection in Time Division Multiplexed Etch Processes
Method and Apparatus for Process Control in Time Division Multiplexed (Tdm) Etch Process
Etching of Chromium Layers on Photomasks Utilizing High Density Plasma and Low Frequency Rf Bias
Envelope Follower End Point Detection in Time Division Multiplexed Processes
Method and Apparatus for Process Control in Time Division Multiplexed (Tdm) Etch Processes
Method and Apparatus for Reducing Aspect Ratio Dependent Etching in Time Division Multiplexed Etch Processes
Method & Apparatus to Improve Plasma Etch Uniformity
Process Change Detection Through the Use of Evolutionary Algorithms
Optical Emission Interferometry for Pecvd Using a Gas Injection Hole
Method for Etching Photolithographic Substrates
Temperature Control Method for Photolithographic Substrate
Method for Plasma Etching of Positively Sloped Structures
Method to Minimize Cd Etch Bias
Grid Assemblies for Use in Ion Beam Etching Systems and Methods of Utilizing the Grid Assemblies
Patent:
8,703,001 →
Application:
12/244,681 →
Conductive Seal Ring Electrostatic Chuck
Device and Process for Chemical Vapor Phase Treatment
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method for Dicing a Substrate with Back Metal
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Wafer Stage for Symmetric Wafer Processing
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Chemical Vapor Deposition Device
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Patent:
46,339 →
Application:
14/854,127 →
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method for Dicing a Substrate with Back Metal
Powered Anode for Ion Source for Dlc and Reactive Processes
Patent:
9,865,436 →
Application:
15/206,300 →
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method for Removing a Metal Deposit Placed on a Surface in a Chamber
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Device for Treating an Object with Plasma
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method for Removing a Metal Deposit Arranged on a Surface in a Chamber
Method for Producing an Interconnection Comprising a via Extending Through a Substrate
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method for Dicing Die Attach Film
Scanning Ion Beam Etch
Treatment Chamber for a Chemical Vapour Deposition (Cvd) Reactor and Thermalization Process Carried Out in This Chamber
Method for Depositing an Insulating Material into a Via
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 30, 2001
From: WESTERMAN, RUSSELL; CONSTANTINE, CHRISTOPHER
To: UNAXIS USA INC.
Reel/Frame 012339/0494 →
Assignment of Assignor's Interest
Jun 6, 2002
From: KENNEY, MARK D.
To: UNAXIS USA, INC.
Reel/Frame 012978/0139 →
Assignment of Assignor's Interest
Jun 24, 2004
From: WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015498/0852 →
Assignment of Assignor's Interest
Jul 22, 2004
From: LAI, SHOULIANG; WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015595/0802 →
Assignment of Assignor's Interest
Jul 28, 2004
From: WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015626/0938 →
Assignment of Assignor's Interest
Aug 17, 2004
From: CONSTANTINE, CHRISTOPHER; PLUMHOFF, JASON; WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015691/0069 →
Assignment of Assignor's Interest
Aug 16, 2005
From: JOHNSON, DAVID; WESTERMAN, RUSSELL; TEIXEIRA, MICHAEL J.; LAI, SHOULIANG
To: UNAXIS USA INC.
Reel/Frame 016405/0085 →
Assignment of Assignor's Interest
Sep 21, 2005
From: JOHNSON, DAVID; WESTERMAN, RUSSELL; LAI, SHOULIANG
To: UNAXIS USA INC.
Reel/Frame 016566/0040 →
Assignment of Assignor's Interest
Jan 26, 2006
From: JOHNSON, DAVID; WESTERMAN, RUSSELL
To: UNAXIS USA INC.
Reel/Frame 017068/0902 →
Assignment of Assignor's Interest
Jul 12, 2006
From: PLUMHOFF, JASON
To: UNAXIS USA INC.
Reel/Frame 017920/0419 →
Assignment of Assignor's Interest
Sep 6, 2006
From: PLUMHOFF, JASON
To: UNAXIS USA INC.
Reel/Frame 018210/0643 →
Assignment of Assignor's Interest
Sep 13, 2006
From: JOHNSON, DAVID
To: UNAXIS USA INC.
Reel/Frame 018241/0971 →
Assignment of Assignor's Interest
Jan 22, 2007
From: PLUMHOFF, JASON
To: OERLIKON USA INC.
Reel/Frame 018786/0302 →
Assignment of Assignor's Interest
Jul 30, 2007
From: PLUMHOFF, JASON; RYAN, LARRY; NOLAN, JOHN; JOHNSON, DAVID
To: OERLIKON USA, INC.
Reel/Frame 019621/0228 →
Assignment of Assignor's Interest
Nov 28, 2007
From: LAI, SHOULIANG; MACKENZIE, KEN; JOHNSON, DAVID
To: OERLIKON USA, INC.
Reel/Frame 020170/0723 →
Assignment of Assignor's Interest
Feb 5, 2009
From: OERLIKON USA, INC.
To: PLASMA-THERM, LLC
Reel/Frame 022203/0740 →
Assignment of Assignor's Interest
Apr 2, 2013
From: OERLIKON USA INC.
To: PLASMA-THERM, LLC
Reel/Frame 030134/0245 →
Security Agreement
Apr 5, 2013
From: PLASMA-THERM, LLC
To: TD BANK, N.A.
Reel/Frame 030157/0772 →
Security Interest
Apr 28, 2015
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
To: SUNTRUST BANK
Reel/Frame 035509/0738 →
Release of Security Interest
Jul 30, 2015
From: TD BANK, N.A.
To: PLASMA-THERM, LLC
Reel/Frame 036221/0402 →
Security Interest
Sep 13, 2016
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
To: SUNTRUST BANK
Reel/Frame 039706/0927 →
Release of Security Interest
Nov 28, 2018
From: SUNTRUST BANK
To: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
Reel/Frame 047608/0189 →
Security Interest
Nov 29, 2018
From: HINE AUTOMATION, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047687/0357 →
Security Interest
Nov 29, 2018
From: DRYTEK, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048174/0001 →
Security Interest
Nov 29, 2018
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048173/0954 →