Method and apparatus for plasma dicing a semi-conductor wafer
The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
1. A method for plasma dicing a substrate, the method comprising:
providing a process chamber having a wall;
providing a plasma source adjacent to the wall of the process chamber;
providing a work piece support within the process chamber;
providing an electrostatic chuck within said work piece support, said electrostatic chuck having at least one clamping electrode and a seal band;
placing a work piece onto said work piece support, said work piece having a support film, a frame and the substrate;
generating a plasma using the plasma source; and
etching the substrate of said work piece using the generated plasma while said work piece is electrostatically clamped and while said clamping electrode extends beyond a periphery of the substrate of said work piece and overlaps the seal band, wherein said clamping electrode overlaps a portion of the frame.
2. The method according to claim 1 further comprising said clamping electrode completely overlapping the substrate.
3. The method according to claim 2 further comprising a first diameter of said clamping electrode being larger than a second diameter of the substrate.
4. The method according to claim 2 further comprising said clamping electrode being continuous in a region where said clamping electrode is overlapped by the substrate.
5. A method for plasma dicing a substrate, the method comprising:
providing a process chamber having a wall;
providing a plasma source adjacent to the wall of the process chamber;
providing a work piece support within the process chamber;
providing an electrostatic chuck within said work piece support, said electrostatic chuck having a seal band, a fluid inlet and at least one clamping electrode;
placing a work piece onto said work piece support, said work piece having a support film, a frame and the substrate;
generating a plasma using the plasma source; and
etching the substrate of the work piece using the generated plasma while said work piece is electrostatically clamped, and while the substrate of said work piece does not overlap said fluid inlet, wherein said clamping electrode overlaps a portion of the frame.
6. The method according to claim 5 further comprising said clamping electrode completely overlapping the substrate.
7. The method according to claim 6 further comprising said clamping electrode being continuous in a region where said clamping electrode is overlapped by the substrate.
8. The method according to claim 7 further comprising said seal band completely encircling the substrate.