IP Library Granted Patent US 8,139,340
Granted Patent B2
US 8,139,340 · App. 12/689,784 · Granted Mar 20, 2012

Conductive seal ring electrostatic chuck

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Quick Facts
Patent No.
US 8,139,340
App. No.
12/689,784
Granted
Mar 20, 2012
Kind
B2
Abstract

The present invention provides an improved electrostatic chuck for a substrate processing system. The electrostatic chuck comprising a main body having a top surface configured to support the substrate, a power supply to apply a voltage to the main body and a sealing ring disposed between the main body and the substrate wherein the sealing ring has a conductive layer.

Claims (36)

1. In a substrate processing system, an electrostatic chuck comprising:

a main body having a top surface configured to support the substrate;

a power supply to apply a voltage to said main body; and

a sealing ring disposed between said main body and the substrate, said sealing ring having an applied conductive coating, said conductive coating being applied to said sealing ring from the group consisting of sputtering, evaporation, chemical vapor deposition, pulsed laser deposition, electroplating, thermal spray, plasma spray, screen printing, painting and rubbing.

2. The electrostatic chuck of claim 1 wherein said conductive coating is plasma resistant.

3. The electrostatic chuck of claim 1 wherein said conductive coating has a sheet resistance of less than or equal to about 1000 ohms per square.

4. The electrostatic chuck of claim 1 wherein said conductive coating contains a metal.

5. The electrostatic chuck of claim 4 wherein said metal is selected from the group consisting of Pt, Pd, Rh and Ni.

6. The electrostatic chuck of claim 1 wherein said conductive coating is a conductive oxide.

7. The electrostatic chuck of claim 6 wherein said conductive oxide is selected from the group consisting of ITO and SnO.

8. The electrostatic chuck of claim 1 wherein said conductive coating contains carbon.

9. The electrostatic chuck of claim 8 wherein said conductive coating contains nanotubes.

10. The electrostatic chuck of claim 1 wherein said power supply further comprising one or more electrodes.

11. In a substrate processing system, an electrostatic chuck comprising:

a main body having a top surface configured to support the substrate;

a power supply to apply a voltage to said main body; and

a sealing ring disposed between said main body and the substrate, said sealing ring is implanted with ions.

12. A method for fabricating a conductive seal ring of an electrostatic chuck for use in a substrate processing system, the method comprising:

providing the seal ring;

implanting ions into the seal ring; and

annealing the implanted seal ring.

13. A method for fabricating an electrostatic chuck conductive seal ring for use in a substrate processing system, the method comprising:

providing the electrostatic chuck seal ring; and

applying a conductive coating to the electrostatic chuck seal ring, said application of the coating being carried out from the group consisting of sputtering, evaporation, chemical vapor deposition, pulsed laser deposition, electroplating, thermal spray, plasma spray, screen printing, painting and rubbing.

14. The method for fabricating an electrostatic chuck conductive seal ring according to claim 13 wherein said application of said conductive coating further comprising:

applying an initial adhesion layer to the electrostatic chuck seal ring;

applying an intermediate barrier layer to the initial adhesion layer; and

applying a conductive layer to the intermediate barrier layer.

15. The method for fabricating an electrostatic chuck conductive seal ring according to claim 13 wherein said conductive coating is plasma resistant.

16. The method for fabricating an electrostatic chuck conductive seal ring according to claim 13 wherein said conductive coating has a sheet resistance of less than or equal to about 1000 ohms per square.

17. The method for fabricating an electrostatic chuck conductive seal ring according to claim 13 wherein said conductive coating contains a metal.

18. The method for fabricating an electrostatic chuck conductive seal ring according to claim 17 wherein said metal is selected from the group consisting of Pt, Pd, Rh and Ni.

19. The method for fabricating an electrostatic chuck conductive seal ring according to claim 13 wherein said conductive coating is a conductive oxide.

20. The method for fabricating an electrostatic chuck conductive seal ring according to claim 19 wherein said conductive oxide is selected from the group consisting of ITO and SnO.

21. The method for fabricating an electrostatic chuck conductive seal ring according to claim 13 wherein said conductive coating contains carbon.

22. The method for fabricating an electrostatic chuck conductive seal ring according to claim 21 wherein said conductive coating contains nanotubes.

Assignments (20)
RELEASE OF SECURITY INTEREST Recorded Aug 3, 2022
From: HSBC BANK USA, N.A.
To: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; PLASMA-THERM IC-DISC, INC.; PLASMA-THERM NES, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; HINE AUTOMATION, LLC; DRYTEK LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
Reel/Frame 061070/0642 →
SECURITY INTEREST Recorded Jun 28, 2022
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; HINE AUTOMATION, LLC; DRYTEK, LLC; PLASMA-THERM NES, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA THERM IC-DISC, INC.
To: VALLEY NATIONAL BANK
Reel/Frame 060447/0766 →
SECURITY INTEREST Recorded Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058899/0658 →
SECURITY INTEREST Recorded Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058945/0169 →
SECURITY INTEREST Recorded May 15, 2020
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM, NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 052679/0001 →
SECURITY INTEREST Recorded May 15, 2020
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 052679/0788 →
SECURITY INTEREST Recorded Nov 30, 2018
From: HINE AUTOMATION, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047688/0644 →
SECURITY INTEREST Recorded Nov 30, 2018
From: PLASMA-THERM IC-DISC, INC.; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047687/0418 →
SECURITY INTEREST Recorded Nov 30, 2018
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047688/0061 →
SECURITY INTEREST Recorded Nov 30, 2018
From: DRYTEK, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047688/0813 →
SECURITY INTEREST Recorded Nov 30, 2018
From: PLASMA-THERM IC-DISC, INC.; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047689/0098 →
SECURITY INTEREST Recorded Nov 29, 2018
From: HINE AUTOMATION, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047687/0357 →
SECURITY INTEREST Recorded Nov 29, 2018
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048173/0954 →
SECURITY INTEREST Recorded Nov 29, 2018
From: DRYTEK, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048174/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 28, 2018
From: SUNTRUST BANK
To: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM IC-DISC, INC.; DRYTEK, LLC
Reel/Frame 047608/0189 →
SECURITY INTEREST Recorded Sep 13, 2016
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM IC-DISC, INC.; DRYTEK, LLC; HINE AUTOMATION, LLC
To: SUNTRUST BANK
Reel/Frame 039706/0927 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2015
From: TD BANK, N.A.
To: PLASMA-THERM, LLC
Reel/Frame 036221/0402 →
SECURITY INTEREST Recorded Apr 28, 2015
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM IC-DISC, INC.; DRYTEK, LLC
To: SUNTRUST BANK
Reel/Frame 035509/0738 →
SECURITY AGREEMENT Recorded Apr 5, 2013
From: PLASMA-THERM, LLC
To: TD BANK, N.A.
Reel/Frame 030157/0772 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2010
From: REYNOLDS, GLYN J.
To: PLASMA-THERM LLC
Reel/Frame 024552/0354 →