Patent Assignment
Reel/Frame 030157/0772
Security Agreement
Recorded: 2013-04-05
Pages: 23
Assignor
PLASMA-THERM, LLC
Executed: 2013-03-29
Assignee
TD BANK, N.A.
2307 WEST KENNEDY BOULEVARD, TAMPA, FLORIDA, 33609
Covered Properties
(36)
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
PCT:
PCT/US2012/028771 ↗
Apparatus for Conveying a Semiconductor Wafer
Patent:
4,584,045 →
Application:
06/581,856 →
Etching Process for Producing Substantially Undercut Free Silicon on Insulator Structures
Patent:
6,071,822 →
Application:
09/127,762 →
Morphed Processing of Semiconductor Devices
Patent:
6,417,013 →
Application:
09/239,723 →
Rotating Magnet Array and Sputter Source
Patent:
6,258,217 →
Application:
09/406,853 →
Magnetic Pole Fabrication Process and Device
Patent:
6,540,928 →
Application:
09/658,023 →
Magnetic Pole Fabrication Process and Device
Patent:
6,547,975 →
Application:
09/696,739 →
Method for Thin Film Lift-Off Processes Using Lateral Extended Etching Masks and Device
Embedded Attenuated Phase Shift Mask and Method of Making Embedded Attenuated Phase Shift Mask
Perimeter Seal for Backside Cooling of Substrates
Method for Etching Vias
Notch-Free Etching of High Aspect Soi Structures Using Alternating Deposition and Etching and Pulsed Plasma
End Point Detection in Time Division Multiplexed Etch Processes
Method and Apparatus for Process Control in Time Division Multiplexed (Tdm) Etch Process
Etching of Chromium Layers on Photomasks Utilizing High Density Plasma and Low Frequency Rf Bias
Envelope Follower End Point Detection in Time Division Multiplexed Processes
Method and Apparatus for Process Control in Time Division Multiplexed (Tdm) Etch Processes
Method and Apparatus for Reducing Aspect Ratio Dependent Etching in Time Division Multiplexed Etch Processes
Method & Apparatus to Improve Plasma Etch Uniformity
Process Change Detection Through the Use of Evolutionary Algorithms
Optical Emission Interferometry for Pecvd Using a Gas Injection Hole
Method for Etching Photolithographic Substrates
Apparatus and Method for Carrying Substrates
Application:
11/681,805 →
Publication:
US 2007/0217119
Temperature Control Method for Photolithographic Substrate
Method for Plasma Etching of Positively Sloped Structures
Method to Minimize Cd Etch Bias
Conductive Seal Ring Electrostatic Chuck
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method to Determine the Thickness of a Thin Film During Plasma Deposition
Application:
13/445,211 →
Publication:
US 2013/0273237
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method for Dicing a Substrate with Back Metal
Application:
61/707,464 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Feb 21, 1984
From: RICHARDS, EDMOND A.
To: PLASMA THERM INC A NJ CORP
Reel/Frame 004232/0792 →
Assignment of Assignors Interest.
Jul 6, 1992
From: PLASMA-THERM, INC. A NJ CORP.
To: PLASMA-THERM I.P. INC. A DE CORP.
Reel/Frame 006163/0984 →
Merger
Jun 1, 1998
From: PLASMA-THERM I.P. INC., A DELAWARE CORPORATION
To: PLASMA-THERM, INC., A FLORIDA CORPORATION
Reel/Frame 009214/0533 →
Assignment of Assignor's Interest
Oct 20, 1998
From: DONOHUE, JOHN F.; JOHNSON, DAVID J.; DEVRE, MICHAEL W.
To: PLASMA-THERM, INC.
Reel/Frame 009527/0937 →
Assignment of Assignor's Interest
Apr 12, 1999
From: TEIXEIRA, MICHAEL J.; DEVRE, MIKE; DAWSON, WADE; JOHNSON, DAVE
To: PLASMA-THERM, INC.
Reel/Frame 009881/0423 →
Assignment of Assignor's Interest
Dec 10, 1999
From: RICHARDS, EDMOND A.; FOURNIER, PAUL R.; JOHNSON, DAVID; LATEEF, ABDUL
To: PLASMA-THERM, INC.
Reel/Frame 010430/0423 →
Assignment of Assignor's Interest
Jan 18, 2001
From: KOBRIN, BORIS; OSTAN, EDWARD
To: UNAXIS USA INC.
Reel/Frame 011451/0844 →
Assignment of Assignor's Interest
Feb 20, 2001
From: KOBRIN, BORIS
To: UNAXIS USA INC.
Reel/Frame 011544/0260 →
Assignment of Assignor's Interest
May 2, 2001
From: LISHAN, DAVID G.
To: UNAXIS USA
Reel/Frame 011780/0322 →
Assignment of Assignor's Interest
Nov 30, 2001
From: WESTERMAN, RUSSELL; CONSTANTINE, CHRISTOPHER
To: UNAXIS USA INC.
Reel/Frame 012339/0494 →
Assignment of Assignor's Interest
Jun 6, 2002
From: KENNEY, MARK D.
To: UNAXIS USA, INC.
Reel/Frame 012978/0139 →
Assignment of Assignor's Interest
Jun 24, 2004
From: WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015498/0852 →
Assignment of Assignor's Interest
Jul 22, 2004
From: LAI, SHOULIANG; WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015595/0802 →
Assignment of Assignor's Interest
Jul 28, 2004
From: WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015626/0938 →
Assignment of Assignor's Interest
Aug 17, 2004
From: CONSTANTINE, CHRISTOPHER; PLUMHOFF, JASON; WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015691/0069 →
Assignment of Assignor's Interest
Aug 16, 2005
From: JOHNSON, DAVID; WESTERMAN, RUSSELL; TEIXEIRA, MICHAEL J.; LAI, SHOULIANG
To: UNAXIS USA INC.
Reel/Frame 016405/0085 →
Assignment of Assignor's Interest
Sep 21, 2005
From: JOHNSON, DAVID; WESTERMAN, RUSSELL; LAI, SHOULIANG
To: UNAXIS USA INC.
Reel/Frame 016566/0040 →
Assignment of Assignor's Interest
Jan 26, 2006
From: JOHNSON, DAVID; WESTERMAN, RUSSELL
To: UNAXIS USA INC.
Reel/Frame 017068/0902 →
Assignment of Assignor's Interest
Jul 12, 2006
From: PLUMHOFF, JASON
To: UNAXIS USA INC.
Reel/Frame 017920/0419 →
Assignment of Assignor's Interest
Sep 6, 2006
From: PLUMHOFF, JASON
To: UNAXIS USA INC.
Reel/Frame 018210/0643 →
Assignment of Assignor's Interest
Feb 5, 2009
From: OERLIKON USA, INC.
To: PLASMA-THERM, LLC
Reel/Frame 022203/0740 →
Assignment of Assignor's Interest
Apr 2, 2013
From: OERLIKON USA INC.
To: PLASMA-THERM, LLC
Reel/Frame 030134/0245 →
Security Interest
Apr 28, 2015
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
To: SUNTRUST BANK
Reel/Frame 035509/0738 →
Release of Security Interest
Jul 30, 2015
From: TD BANK, N.A.
To: PLASMA-THERM, LLC
Reel/Frame 036221/0402 →
Security Interest
Sep 13, 2016
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
To: SUNTRUST BANK
Reel/Frame 039706/0927 →