Method to minimize CD etch bias
View Patent ↗The present invention provides a method for improving the critical dimension performance during a plasma etching process of a photolithographic substrate having a thin film. A passivation film is deposited onto the photolithographic substrate using a first set of process conditions. The deposited film is etched from the photolithographic substrate using a second set of process conditions. An exposed surface of the photolithographic substrate is etched using a third set of process conditions. During the plasma processing of the photolithographic substrate, the critical dimension performance of the photolithographic substrate is monitored to insure that the target uniformity and feature widths are obtained by adjusting the deposition and etch plasma processing of the photolithographic substrate.
1. A method for improving a critical dimension performance during a plasma etching process of a photolithographic substrate, comprising:
providing a photomask comprising, in order, a photolithographic reticle having a thin film that has been previously deposited on said photolithographic reticle, an etch mask that has been previously patterned on said thin film;
placing said patterned etch mask on a support member in a vacuum chamber;
introducing a process gas into said vacuum chamber, at least some portion of the process gas is introduced coplanar to said patterned etch mask;
depositing a passivation film on non-horizontal surfaces and horizontal surfaces of said patterned etch mask using a first set of process conditions, said first set of process conditions including the use of said introduced process gas and said introduced portion of coplanar process gas;
clearing the deposited passivation film from the horizontal surfaces of said patterned etch mask using a second set of process conditions while some of the deposited passivation film remains on at least some of the non-horizontal surfaces of said patterned etch mask;
etching an exposed surface of the thin film using a third set of process conditions;
monitoring the critical dimension performance of said patterned etch mask using in-situ metrology; and
adjusting the deposition step in-situ based on the monitoring step to achieve a desired critical dimension performance.
2. The method according to claim 1 wherein said passivation film is deposited non-conformally on said patterned etch mask.
3. The method according to claim 1 wherein said passivation film is formed from the group consisting of a carbon containing gas, a silicon containing gas and a sulfur containing gas.
4. The method according to claim 1 wherein said passivation film comprises a polymer based film.
5. The method according to claim 4 wherein said polymer based film is formed from a hydrocarbon containing gas.
6. The method according to claim 1 wherein said thin film is at least partially transmissive to light.
7. The method according to claim 1 wherein said thin film comprises chromium.
8. The method according to claim 1 wherein said thin film comprises silicon.
9. A method for improving a critical dimension performance during a plasma etching process of a photolithographic substrate, comprising:
providing a photomask comprising, in order, a photolithographic reticle having a thin film, that has been previously deposited on said photolithographic reticle, an etch mask that has been previously patterned on said thin film;
identifying a target critical dimension performance, said target critical dimension performance is less than an initial critical dimension performance of said patterned etch mask;
characterizing the critical dimension performance of a deposition process to achieve the target critical dimension performance;
characterizing the critical dimension performance of a first etch process to achieve the target critical dimension performance;
characterizing the critical dimension performance of a second etch process to achieve the target critical dimension performance;
selecting a first set of process conditions based on said characterized critical dimension performance of said deposition process step;
placing said patterned etch mask on a support member in a vacuum chamber;
introducing a process gas into said vacuum chamber, at least some portion of the process gas is introduced coplanar to said patterned etch mask;
depositing a passivation film on non-horizontal surfaces and horizontal surfaces of the patterned etch mask using said first set of process conditions, said first set of process conditions including the use of said introduced process gas and said introduced portion of coplanar process gas;
selecting a second set of process conditions based on said characterized critical dimension performance of said first etch process step;
clearing the deposited passivation film from the horizontal surfaces of the patterned etch mask using said second set of process conditions while some of the deposited passivation film remains on at least some of the non-horizontal surfaces of said patterned etch mask;
selecting a third set of process conditions based on said characterized critical dimension performance of said second etch process step; and
etching an exposed surface of the thin film using said third set of process conditions.
10. The method according to claim 9 wherein said passivation film is deposited non-conformally on the patterned etch mask.
11. The method according to claim 9 wherein said passivation film is formed from the group consisting of a carbon containing gas, a silicon containing gas and a sulfur containing gas.
12. The method according to claim 9 wherein said passivation film comprises a polymer based film.
13. The method according to claim 12 wherein said polymer based film is formed from a hydrocarbon containing gas.
14. The method according to claim 9 wherein said thin film is at least partially transmissive to light.
15. The method according to claim 9 wherein said thin film comprises chromium.
16. The method according to claim 9 wherein said thin film comprises silicon.