Granted Patent B2

US 8,980,764 · App. 13/764,160 · Granted Mar 17, 2015

Abstract

Claims (13)

1. A method for plasma dicing a substrate, the method comprising:

providing a process chamber having a wall;

providing a plasma source adjacent to the wall of the process chamber, the plasma source generating a plasma in the process chamber;

providing a work piece support within the process chamber;

providing a lifting mechanism within the work piece support;

placing the substrate onto a support film on a frame to form a work piece;

placing the work piece onto the work piece support using the lifting mechanism, the lifting mechanism touching a portion of the work piece overlapped by the frame;

providing a mechanical partition positioned below the plasma source, said mechanical partition positioned above the work piece; and

etching the work piece through the generated high from the plasma source with said mechanical partition being positioned below the plasma source and said mechanical partition being positioned above the work piece.

2. The method according to claim 1 wherein the mechanical partition further comprising a conductive material.

3. The method according to claim 2 wherein the mechanical partition further comprising being coated with a plasma resistant coating.

4. The method according to claim 1 wherein the mechanical partition further comprising a plurality of holes.

5. The method according to claim 1 wherein the mechanical partition being fixedly mounted to said wall of the process chamber.

Assignments (21)