Etching of chromium layers on photomasks utilizing high density plasma and low frequency RF bias
View Patent ↗The present invention provides a method and an apparatus for etching a photolithographic substrate. The photolithographic substrate is placed on a support member in a vacuum chamber. A processing gas for etching a material from the photolithographic substrate is introduced into the vacuum chamber, and a plasma is generated. An RF bias is supplied to the support member in the vacuum chamber through an RF bias frequency generator at or below the ion transit frequency. Exposed material is etched from the photolithographic substrate with improved CD Etch Linearity and CD Etch Bias since the low frequency bias allows the developed charge on the photolithographic substrate, generated by the plasma, to dissipate.
1. A method for etching a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber, the photolithographic substrate is comprised of a silicon containing material;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying an RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching the photolithographic substrate.
2. A method for etching a photolithographic quartz substrate comprising the steps of:
placing the photolithographic quartz substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying an RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching the photolithographic quartz substrate.
3. A method for etching a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber, the photolithographic substrate comprises an optically transparent material;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying an RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching the photolithographic substrate.
4. The method of claim 1 wherein the photolithographic substrate further comprises a patterned masking layer.
5. The method of claim 4 wherein the masking layer is photoresist.
6. The method of claim 4 wherein the masking layer contains a metal.
7. The method of claim 1 wherein the RF bias to the substrate support is voltage controlled.
8. The method of claim 7 wherein said RF bias has a Peak-to-Peak voltage of less than about 1.5 kV.
9. The method of claim 1 wherein the RF bias frequency is less than about 2 MHz.
10. The method of claim 1 wherein the RF bias frequency is about 380 kHz.
11. A method for etching a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a modulated RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching the photolithographic substrate.
12. A method for etching a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a pulsing RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching the photolithographic substrate.
13. A method for etching a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a pulsing RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber, the duty cycle of the pulsed waveform is less than about 50%; and
etching the photolithographic substrate.
14. A method for etching a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a modulated RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber, the modulated RF bias waveform has a modulation period of less than about 10 ms; and
etching the photolithographic substrate.
15. A method for etching a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a modulated RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber, the RF bias waveform is amplitude modulated; and
etching the photolithographic substrate.
16. A method for etching a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a modulated RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber, the RF bias waveform is frequency modulated; and
etching the photolithographic substrate.
17. A method for etching chromium containing material on a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying an RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching the chromium containing material from the photolithographic substrate.
18. A method for etching a material containing a refractory metal on a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying an RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching the refractory metal from the photolithographic substrate.
19. A method for etching silicon containing material on a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying an RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching the silicon containing material from the photolithographic substrate.
20. A method for etching at least one material on a photolithographic substrate having a patterned masking layer comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying an RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching at least one material from the photolithographic substrate.
21. A method for etching at least one material on a photolithographic substrate having a patterned photoresist masking layer comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying an RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching at least one material from the photolithographic substrate.
22. A method for etching at least one material on a photolithographic substrate having a masking layer containing a metal comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying an RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching at least one material from the photolithographic substrate.
23. The method of claim 17 wherein the RF bias to the substrate support is voltage controlled.
24. The method of claim 23 wherein said RF bias has a Peak-to-Peak voltage of less than about 1.5 kV.
25. The method of claim 17 wherein the RF bias frequency is less than about 2 MHz.
26. The method of claim 17 wherein the RF bias frequency is about 380 kHz.
27. A method for etching at least one material on a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a modulated RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching at least one material from the photolithographic substrate.
28. A method for etching at least one material on a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a pulsing RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber; and
etching at least one material from the photolithographic substrate.
29. A method for etching at least one material on a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a pulsing RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber, the duty cycle of the pulsed waveform is less than about 50%; and
etching at least one material from the photolithographic substrate.
30. A method for etching at least one material on a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a modulated RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber, the modulated RF bias waveform has a modulation period of less than about 10 ms; and
etching at least one material from the photolithographic substrate.
31. A method for etching at least one material on a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a modulated RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber, the RF bias waveform is amplitude modulated; and
etching at least one material from the photolithographic substrate.
32. A method for etching at least one material on a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a modulated RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber, the RF bias waveform is frequency modulated; and
etching at least one material from the photolithographic substrate.
33. An apparatus for processing a photolithographic substrate comprising:
a vacuum chamber;
at least one gas supply communicating with said vacuum chamber for providing at least one process gas to said vacuum chamber;
a plasma generating source for generating a plasma in said vacuum chamber;
an RF bias power source operating at an RF frequency at or below the ion transit a frequency of less than about 1 MHz, said RF bias power source coupled to the photolithographic substrate support; and
an RF modulator for modulating the RF bias waveform.
34. A method for etching a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a pulsed RF bias at a frequency of less than about 1 MHz the support member in the vacuum chamber;
controlling the level of the RF bias;
and etching the photolithographic substrate.
35. A method for etching a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying a modulated RF bias at a frequency of less than about 1 MHz to the support member in the vacuum chamber;
controlling the level of the RF bias;
and etching the photolithographic substrate.
36. A method for etching a photolithographic substrate comprising the steps of:
placing the photolithographic substrate on a support member in a vacuum chamber;
introducing at least one process gas into the vacuum chamber;
generating a plasma;
supplying an RF bias to the support member in the vacuum chamber, the applied RF bias is at a frequency of less than about 1 MHz;
controlling the level of the RF bias; and
etching the photolithographic substrate.