Patent Assignment
Reel/Frame 022203/0740
Assignment of Assignor's Interest
Recorded: 2009-02-05
Pages: 6
Assignor
OERLIKON USA, INC.
Executed: 2009-01-26
Assignee
PLASMA-THERM, LLC
10050 16TH STREET NORTH, ST. PETERSBURG, FLORIDA, 33716
Covered Properties
(24)
Etching Process for Producing Substantially Undercut Free Silicon on Insulator Structures
Patent:
6,071,822 →
Application:
09/127,762 →
Morphed Processing of Semiconductor Devices
Patent:
6,417,013 →
Application:
09/239,723 →
Magnetic Pole Fabrication Process and Device
Patent:
6,540,928 →
Application:
09/658,023 →
Magnetic Pole Fabrication Process and Device
Patent:
6,547,975 →
Application:
09/696,739 →
Method for Thin Film Lift-Off Processes Using Lateral Extended Etching Masks and Device
Perimeter Seal for Backside Cooling of Substrates
Etching of thin damage sensitive layers using high frequency pulsed plasma
Application:
10/277,261 →
Publication:
US 2003/0077910
End Point Detection in Time Division Multiplexed Etch Processes
Method and Apparatus for Process Control in Time Division Multiplexed (Tdm) Etch Process
Etching of Chromium Layers on Photomasks Utilizing High Density Plasma and Low Frequency Rf Bias
Envelope Follower End Point Detection in Time Division Multiplexed Processes
Notch-free etching of high aspect SOI structures using a time division multiplex process and RF bias modulation
Application:
10/968,823 →
Publication:
US 2005/0112891
Method and Apparatus for Process Control in Time Division Multiplexed (Tdm) Etch Processes
Method and Apparatus for Reducing Aspect Ratio Dependent Etching in Time Division Multiplexed Etch Processes
Selection of wavelengths for end point in a time division multiplexed process
Application:
11/210,248 →
Publication:
US 2006/0006139
Method & Apparatus to Improve Plasma Etch Uniformity
Process Change Detection Through the Use of Evolutionary Algorithms
Optical Emission Interferometry for Pecvd Using a Gas Injection Hole
Method for Etching Photolithographic Substrates
Notch-Free Etching of High Aspect SOI Structures Using A Time Division Multiplex Process and RF Bias Modulation
Application:
11/681,004 →
Publication:
US 2007/0175856
Apparatus and Method for Carrying Substrates
Application:
11/681,805 →
Publication:
US 2007/0217119
Temperature Control Method for Photolithographic Substrate
Method for Plasma Etching of Positively Sloped Structures
Conductive Seal Ring Electrostatic Chuck
Application:
61/145,871 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 20, 1998
From: DONOHUE, JOHN F.; JOHNSON, DAVID J.; DEVRE, MICHAEL W.
To: PLASMA-THERM, INC.
Reel/Frame 009527/0937 →
Assignment of Assignor's Interest
Apr 12, 1999
From: TEIXEIRA, MICHAEL J.; DEVRE, MIKE; DAWSON, WADE; JOHNSON, DAVE
To: PLASMA-THERM, INC.
Reel/Frame 009881/0423 →
Assignment of Assignor's Interest
Jan 18, 2001
From: KOBRIN, BORIS; OSTAN, EDWARD
To: UNAXIS USA INC.
Reel/Frame 011451/0844 →
Assignment of Assignor's Interest
Feb 20, 2001
From: KOBRIN, BORIS
To: UNAXIS USA INC.
Reel/Frame 011544/0260 →
Assignment of Assignor's Interest
May 2, 2001
From: LISHAN, DAVID G.
To: UNAXIS USA
Reel/Frame 011780/0322 →
Assignment of Assignor's Interest
Jun 6, 2002
From: KENNEY, MARK D.
To: UNAXIS USA, INC.
Reel/Frame 012978/0139 →
Assignment of Assignor's Interest
Oct 22, 2002
From: WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA, INC.
Reel/Frame 013410/0592 →
Assignment of Assignor's Interest
Jun 24, 2004
From: WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015498/0852 →
Assignment of Assignor's Interest
Jul 22, 2004
From: LAI, SHOULIANG; WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015595/0802 →
Assignment of Assignor's Interest
Jul 28, 2004
From: WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015626/0938 →
Assignment of Assignor's Interest
Aug 17, 2004
From: CONSTANTINE, CHRISTOPHER; PLUMHOFF, JASON; WESTERMAN, RUSSELL; JOHNSON, DAVID J.
To: UNAXIS USA INC.
Reel/Frame 015691/0069 →
Assignment of Assignor's Interest
Jan 21, 2005
From: JOHNSON, DAVID; SRINIVASAN, SUNIL; WESTERMAN, RUSSELL
To: UNAXIS USA INC.
Reel/Frame 016194/0853 →
Assignment of Assignor's Interest
Aug 16, 2005
From: JOHNSON, DAVID; WESTERMAN, RUSSELL; TEIXEIRA, MICHAEL J.; LAI, SHOULIANG
To: UNAXIS USA INC.
Reel/Frame 016405/0085 →
Assignment of Assignor's Interest
Sep 21, 2005
From: JOHNSON, DAVID; WESTERMAN, RUSSELL; LAI, SHOULIANG
To: UNAXIS USA INC.
Reel/Frame 016566/0040 →
Assignment of Assignor's Interest
Nov 10, 2005
From: JOHNSON, DAVID; WESTERMAN, RUSSELL
To: UNAXIS USA INC.
Reel/Frame 016760/0085 →
Assignment of Assignor's Interest
Jan 26, 2006
From: JOHNSON, DAVID; WESTERMAN, RUSSELL
To: UNAXIS USA INC.
Reel/Frame 017068/0902 →
Assignment of Assignor's Interest
Jul 12, 2006
From: PLUMHOFF, JASON
To: UNAXIS USA INC.
Reel/Frame 017920/0419 →
Assignment of Assignor's Interest
Sep 6, 2006
From: PLUMHOFF, JASON
To: UNAXIS USA INC.
Reel/Frame 018210/0643 →
Assignment of Assignor's Interest
Sep 13, 2006
From: JOHNSON, DAVID
To: UNAXIS USA INC.
Reel/Frame 018241/0971 →
Assignment of Assignor's Interest
Jan 22, 2007
From: PLUMHOFF, JASON
To: OERLIKON USA INC.
Reel/Frame 018786/0302 →
Security Agreement
Apr 5, 2013
From: PLASMA-THERM, LLC
To: TD BANK, N.A.
Reel/Frame 030157/0772 →
Security Interest
Apr 28, 2015
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
To: SUNTRUST BANK
Reel/Frame 035509/0738 →
Release of Security Interest
Jul 30, 2015
From: TD BANK, N.A.
To: PLASMA-THERM, LLC
Reel/Frame 036221/0402 →
Security Interest
Sep 13, 2016
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
To: SUNTRUST BANK
Reel/Frame 039706/0927 →
Release of Security Interest
Nov 28, 2018
From: SUNTRUST BANK
To: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
Reel/Frame 047608/0189 →