Method and apparatus for plasma dicing a semi-conductor wafer
View Patent ↗The present invention provides a method for plasma processing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing at least two cutting regions on the substrate, the cutting regions being positioned between all adjacent device structures on the substrate; generating a plasma using the plasma source; and processing the work piece using the generated plasma.
1. A method for plasma processing a patterned substrate, the method comprising:
providing the patterned substrate having a top surface and a bottom surface, the top surface of the patterned substrate having a plurality of street areas, at least one device structure, and at least one dicing assist region covering a portion of the street areas;
providing a process chamber having a wall;
providing a plasma source adjacent to the wall of the process chamber;
providing a work piece support within the process chamber;
placing a work piece onto said work piece support, said work piece having a support film, a frame and the patterned substrate with the at least one dicing assist region in the plurality of street areas;
generating a plasma using the plasma source; and
etching the top surface of the patterned substrate with the at least one dicing assist region in the plurality of street areas of said work piece using the generated plasma,
wherein the top surface of the patterned substrate faces the plasma and the bottom surface of the patterned substrate faces the work piece support and portions of the street areas not covered by the at least one dicing assist region are cutting regions etched by the plasma.
2. The method according to claim 1 further comprising patterning at least one load assist feature at an outer edge of the top surface of the substrate.
3. The method according to claim 1 further comprising patterning a process control monitor in the at least one dicing assist region.
4. The method according to claim 1 further comprising patterning a separation gap in the at least one dicing assist region.
5. The method according to claim 1 wherein the cutting region etches at least five times faster than the dicing assist region.
6. A method for plasma processing a patterned substrate, the method comprising:
providing the patterned substrate having a top surface and a bottom surface, the top surface having a plurality of street areas, at least one device structure, at least one dicing assist region covering a portion of the street areas, and a plurality of separation gaps formed in the at least one dicing assist regions;
providing a process chamber having a wall;
providing a plasma source adjacent to the wall of the process chamber;
providing a work piece support within the process chamber;
placing a work piece onto said work piece support, said work piece having a support film, a frame and the patterned substrate with the at least one dicing assist regions, and the plurality of separation gaps;
generating a plasma using the plasma source; and
etching the top surface of the patterned substrate with the plurality of separation gaps in the at least one dicing assist regions in the plurality of street areas of said work piece using the generated plasma,
wherein the top surface of the patterned substrate faces the plasma and the bottom surface of the patterned substrate faces the work piece support and portions of the street areas not covered by the at least one dicing assist region are cutting regions etched by the plasma.
7. The method according to claim 6 further comprising patterning at least one load assist feature at an outer edge of the top surface of the substrate.
8. The method according to claim 6 further comprising patterning a process control monitor in the at least one dicing assist region.
9. The method according to claim 6 wherein the cutting region etches at least five times faster than the at least one dicing assist region.