IP Library Granted Patent US 9,863,036
Granted Patent B2
US 9,863,036 · App. 14/697,441 · Granted Jan 9, 2018

Wafer stage for symmetric wafer processing

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Quick Facts
Patent No.
US 9,863,036
App. No.
14/697,441
Granted
Jan 9, 2018
Kind
B2
Abstract

A planetary arm coupled to a tilt actuator moves a wafer in oscillatory motion along an arcuate path to expose a surface of the wafer to an incident ion beam for deposition and/or etching processing of thin film structures on the surface of the wafer. A wafer holder on an end of the planetary arm may be driven in rotation while the planetary arm executes oscillatory motion at a selected tilt angle relative to an incident ion beam. A slit support plate provides controllable exposure of the wafer to the incident beam. Embodiments are suitable for use in wafer deposition machines and/or wafer etching machines.

Claims (26)

1. A planetary scan wafer stage, comprising:

a tilt actuator;

a planetary arm rotatably coupled to said tilt actuator;

a slit support plate attached to said tilt actuator;

a wafer holder rotatably coupled to said planetary arm; and

a planetary scan actuator attached to said tilt actuator and to said planetary arm,

wherein said planetary arm and said slit support plate are rotatable to a selected tilt angle by said tilt actuator and said planetary arm is movable along an arcuate path by said planetary scan actuator.

2. The planetary scan wafer stage of claim 1 , further comprising a wafer rotation drive attached to said planetary arm, wherein said wafer rotation drive is coupled to said wafer holder for rotation of said wafer holder.

3. The planetary scan wafer stage of claim 1 , wherein said arcuate path is a circular arc of constant radius.

4. The planetary scan wafer stage of claim 1 , wherein an oscillatory motion of said planetary arm along said arcuate path and a rotational motion of said wafer holder are capable of coordinated rotation for symmetric processing of thin film structures on a wafer workpiece held in said wafer holder.

5. The planetary scan wafer state of claim 1 , wherein said tilt actuator comprises a stationary collar and a core rotatably coupled to said stationary collar.

6. The planetary scan wafer stage of claim 5 , wherein said planetary arm further comprises an arm hub rotatably coupled to said core.

7. The planetary scan wafer stage of claim 5 , wherein said planetary scan actuator is attached to said core.

8. The planetary scan wafer stage of claim 5 , wherein said slit support plate is attached to said core.

9. The planetary scan wafer stage of claim 5 , further comprising a tilt actuator motor attached to said collar and disposed to drive said core in rotation relative to said collar.

10. The planetary scan wafer stage of claim 1 , wherein said slit support plate is formed with a beam aperture.

11. The planetary scan wafer stage of claim 10 , wherein said beam aperture is formed with a length greater than a diameter of a wafer held in said wafer holder.

12. The planetary scan wafer stage of claim 10 , further comprising a pair of opposing shutter plates slidably coupled to said slit support plate, wherein a separation distance between opposing edges of said opposing shutter plates is adjustable to form a slot of adjustable width.

13. The planetary scan wafer stage of claim 10 , further comprising a first shutter plate rotatably coupled to said slit support plate.

14. The planetary scan wafer stage of claim 13 , wherein said first shutter plate is formed with an aperture for admittance of a beam of particles.

15. The planetary scan wafer stage of claim 13 , wherein said aperture formed in said first shutter plate is formed with a rectangular shape.

16. The planetary scan wafer stage of claim 13 , wherein said aperture formed in said first shutter plate is formed with arcuate edges.

17. The planetary scan wafer stage of claim 13 , wherein said aperture formed in said first shutter plate is formed with opposing edges which are not parallel to one another.

18. The planetary scan wafer stage of claim 13 , further comprising an actuator coupled to said slit support plate and said first shutter plate.

19. The planetary scan wafer stage of claim 13 , further comprising a second shutter plate sized to block said beam aperture in said slit support plate.

20. The planetary scan wafer stage of claim 19 , further comprising an actuator coupled to said slit support plate and said second shutter plate.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Aug 3, 2022
From: HSBC BANK USA, N.A.
To: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; PLASMA-THERM IC-DISC, INC.; PLASMA-THERM NES, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; HINE AUTOMATION, LLC; DRYTEK LLC; LOGIX TECHNOLOGY HOLDINGS, LLC
Reel/Frame 061070/0642 →
SECURITY INTEREST Recorded Jun 28, 2022
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; HINE AUTOMATION, LLC; DRYTEK, LLC; PLASMA-THERM NES, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA THERM IC-DISC, INC.
To: VALLEY NATIONAL BANK
Reel/Frame 060447/0766 →
SECURITY INTEREST Recorded Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058899/0658 →
SECURITY INTEREST Recorded Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058945/0169 →
SECURITY INTEREST Recorded May 15, 2020
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM, NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 052679/0001 →
SECURITY INTEREST Recorded May 15, 2020
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 052679/0788 →
SECURITY INTEREST Recorded Nov 30, 2018
From: PLASMA-THERM IC-DISC, INC.; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047687/0418 →
SECURITY INTEREST Recorded Nov 30, 2018
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047688/0061 →
SECURITY INTEREST Recorded Nov 30, 2018
From: HINE AUTOMATION, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047688/0644 →
SECURITY INTEREST Recorded Nov 30, 2018
From: DRYTEK, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047688/0813 →
SECURITY INTEREST Recorded Nov 30, 2018
From: PLASMA-THERM IC-DISC, INC.; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047689/0098 →
SECURITY INTEREST Recorded Nov 29, 2018
From: HINE AUTOMATION, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047687/0357 →
SECURITY INTEREST Recorded Nov 29, 2018
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048173/0954 →
SECURITY INTEREST Recorded Nov 29, 2018
From: DRYTEK, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048174/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 19, 2016
From: HEGDE, SARPANGALA H.; LEE, VINCENT; GOGLIA, PETER
To: PLASMA-THERM NES LLC
Reel/Frame 039483/0383 →