Device for treating an object with plasma
A system for treating an object with plasma includes a vacuum processing chamber having a holder on which the object to be treated is placed, at least two subassemblies each including at least one plasma source able to generate a plasma and being supplied with radio-frequency power Pi and with a gas i of independent flow rate ni. The plasma generated by one of the subassemblies is a partially ionized gas or gas mixture of different chemical nature from the plasma generated by the other subassembly or subassemblies. A process for selectively treating a composite object employing such a device is described.
1. A processing system for the treatment of an object by plasma comprising:
a treatment vacuum chamber having a support on which the object to be treated is placed;
a first subassembly having at least three plasma sources; and
a second subassembly having at least three other plasma sources, the first subassembly and the second subassembly are arranged as concentric rings, said second subassembly is superimposed over said first subassembly;
each of the first and second subassembly having the three plasma sources each being supplied independently with radio frequency power and gas, the plasma generated by the at least three plasma sources of the first subassembly is from a gas of different chemical nature from the plasma generated by the at least three plasma sources of the second subassembly.
2. The processing system according to claim 1 wherein each plasma source of the first subassembly comprises two discharge chambers in series and each plasma source of the second subassembly comprises two discharge chambers in series.
3. The processing system according to claim 1 wherein the second subassembly surrounds the first subassembly.