Patent Assignment
Reel/Frame 048397/0001
Assignment of Assignor's Interest
Recorded: 2019-02-21
Pages: 6
Assignors
LEE, SANGHOON
Executed: 2019-01-02
SHIN, JIWON
Executed: 2019-01-02
BAEK, HYUNGGIL
Executed: 2019-01-02
KWAK, MINKEUN
Executed: 2019-01-02
LEE, JONGHO
Executed: 2019-01-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Bonding Head and Method for Bonding Semiconductor Package, and Semiconductor Package