Patent Assignment
Reel/Frame 048406/0429
Assignment of Assignor's Interest
Recorded: 2019-02-22
Pages: 3
Assignors
KWAG, DOYOUNG
Executed: 2019-02-07
PARK, SANGMOO
Executed: 2019-02-07
LEE, YOONSUK
Executed: 2019-02-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Transfer Device and Chip Transfering Method Using the Same