Chip transfer device and chip transferring method using the same
A chip transfer device is provided. The chip transfer device according to an embodiment includes a support, a plurality of pick-up modules disposed on the support in a horizontal direction, and movably connected to the support, and a controller configured to control the plurality of pick-up modules, wherein each of the plurality of pick-up modules is movable while collectively picking up a plurality of chips on a corresponding wafer among a plurality of wafers, and wherein the controller moves and adjusts the plurality of pick-up modules in a horizontal direction.
1. A chip transfer device, comprising:
a support;
a plurality of pick-up modules disposed on the support in a horizontal direction,
and movably connected to the support; and
a controller configured to control the plurality of pick-up modules,
wherein each of the plurality of pick-up modules is configured to collectively pick up a plurality of chips arranged in the horizontal direction on a corresponding wafer among a plurality of wafers and to be movable the plurality of chips are collectively picked up by the plurality of pick-up modules, and
wherein the controller is configured to move and adjust the plurality of pick-up modules in the horizontal direction to change intervals between the plurality of chips picked up by each pick-up module,
wherein the controller is configured to adjust the plurality of pick-up modules in the horizontal direction to provide the plurality of pick-up modules at a first interval in the horizontal direction when the plurality of pickup modules are controlled to pick up the plurality of chips, and to adjust the plurality of pick-up modules in the horizontal direction to provide the plurality of pick-up modules at a second interval in the horizontal direction after the plurality of chips are picked up by the plurality of pick-up modules, wherein the second interval is smaller than the first interval.
2. The device as claimed in claim 1 , wherein each of the plurality of pick-up modules comprises:
a connection part movably connected to the support in a horizontal direction;
a pick-up body connected to one end of the connection part; and
a plurality of pick-up heads arranged spaced apart from one another on the pickup body at a first interval.
3. The device as claimed in claim 2 , wherein a length between an outermost pick-up head, among the plurality of pick-up heads arranged on a pick-up body, and a side surface of the pick-up body is half of the first interval.
4. The device as claimed in claim 3 , wherein the controller is configured to move and adjust each connection part in a horizontal direction to render the side surface of the pick-up body to contact a side surface of an adjacent pick-up body while the plurality of pick-up modules pick up the plurality of chips.
5. The device as claimed in claim 4 , wherein the side surface of the pick-up body comprises a tooth-shaped portion configured to engage the side surface of the adjacent pick-up body.
6. The device as claimed in claim 2 , wherein the controller is configured to move and adjust the connection part in a horizontal direction to provide predetermined intervals of the plurality of chips picked up by the pick-up module at the first interval.
7. The device as claimed in claim 2 , wherein each of the plurality of pick-up modules further comprises a connection extension part connecting the connection part and the pick-up body, and
wherein the connection extension part is configured to be movable in a vertical direction from the connection part.
8. The device as claimed in claim 7 , wherein the controller is configured to collectively move and adjust the connection extension part in a vertical direction.
9. The device as claimed in claim 7 , wherein the controller is configured to sequentially control the plurality of pick-up modules while the plurality of pick-up modules pick up the plurality of chips, to control respective connection parts of the plurality of pick-up modules to move in a horizontal direction, and to control each connection extension part to move in a vertical direction.
10. The device as claimed in claim 2 , further comprising:
a stage configured to support the plurality of wafers or a printed circuit board on which the plurality of picked up chips are mounted.
11. The device as claimed in claim 1 , wherein the plurality of wafers are disposed in a grid pattern, and
wherein the plurality of pick-up modules are arranged in a grid pattern respectively corresponding to the plurality of wafers.
12. The device as claimed in claim 1 , wherein the plurality of pick-up modules are configured pick up the plurality of chips simultaneously.
13. The device as claimed in claim 1 , wherein each of the pick-up modules comprises at least one pick-up head.
14. The device as claimed in claim 1 , wherein each of the pick-up modules comprises a plurality of pick-up heads.