Patent Assignment
Reel/Frame 048406/0918
Assignment of Assignor's Interest
Recorded: 2019-02-22
Pages: 4
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
SiC EPITAXIAL WAFER CONTAINING LARGE PIT DEFECTS WITH A SURFACE DENSITY OF 0.5 DEFECTS/CM2 OR LESS, AND PRODUCTION METHOD THEREFOR
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.