Patent Assignment
Reel/Frame 048417/0861
Assignment of Assignor's Interest
Recorded: 2019-02-22
Pages: 4
Assignors
LIN, PO-CHEN
Executed: 2019-02-14
TAIN, RA-MIN
Executed: 2019-02-14
CHIEN, CHUN-HSIEN
Executed: 2019-02-14
CHEN, CHIEN-CHOU
Executed: 2019-02-14
Assignee
UNIMICRON TECHNOLOGY CORP.
NO.38, XINGBANG RD., KWEI-SAN INDUSTRIAL ZONE, TAOYUAN DIST.,, TAOYUAN CITY, 330, TAIWAN
Covered Property
(1)
Embedded Chip Package, Manufacturing Method Thereof, and Package-on-Package Structure