Patent Assignment
Reel/Frame 048428/0933
Assignment of Assignor's Interest
Recorded: 2019-02-25
Pages: 3
Assignors
YANG, JU HWAN
Executed: 2019-01-31
KANG, BYUNG SOO
Executed: 2019-01-31
MOON, BYEONG CHEOL
Executed: 2019-01-31
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Passivation Layer Having Opening for Under Bump Metallurgy
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 1, 2018
From: LEE, HAN UL; KIM, JIN SU; KO, YOUNG GWAN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 045677/0356 →
Corrective Assignment to Correct the Inventorship of the Application. an Incorrect Assignment Was Filed on 2/25/19 Previously Recorded on Reel 048428 Frame 0933. Assignor(S) Hereby Confirms the Assignment.
May 21, 2019
From: LEE, HAN UL; KIM, JIN SU; KO, YOUNG GWAN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 049238/0672 →
Assignment of Assignor's Interest
Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →