Patent Assignment
Reel/Frame 048442/0539
Assignment of Assignor's Interest
Recorded: 2019-02-26
Pages: 4
Assignors
DING, JUN-CHANG
Executed: 2019-01-18
CHANG, HONG-DA
Executed: 2019-01-18
HSU, HSI-CHANG
Executed: 2019-01-18
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DAFENG RD., TANTZI DIST., TAICHUNG CITY, 427, TAIWAN
Covered Property
(1)
Electronic Package, Packaging Substrate, and Methods for Fabricating the Same