Patent Assignment
Reel/Frame 048444/0181
Assignment of Assignor's Interest
Recorded: 2019-02-26
Pages: 4
Assignee
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
1525 ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH PARK, SHANGHAI, 201203, CHINA
Covered Property
(1)
De-Bonding Leveling Device and De-Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.