Patent Assignment
Reel/Frame 048570/0479
Assignment of Assignor's Interest
Recorded: 2019-03-12
Pages: 14
Assignors
KARDA, KAMAL M.
Executed: 2019-01-28
LEE, YI FANG
Executed: 2019-02-14
LIU, HAITAO
Executed: 2019-01-23
RAMASWAMY, DURAI VISHAK NIRMAL
Executed: 2019-03-11
GANDHI, RAMANATHAN
Executed: 2019-01-29
SARPATWARI, KARTHIK
Executed: 2019-01-23
SILLS, SCOTT E.
Executed: 2019-01-22
CHHAJED, SAMEER
Executed: 2019-03-11
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1-525, BOISE, IDAHO, 83716
Covered Property
(1)
Integrated Assemblies Comprising Hydrogen Diffused Within Two or More Different Semiconductor Materials, and Methods of Forming Integrated Assemblies
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 12 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest
Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →