Integrated assemblies comprising hydrogen diffused within two or more different semiconductor materials, and methods of forming integrated assemblies

1. An integrated assembly, comprising:

a first semiconductor material having a first side and an opposing second side;

a second semiconductor material directly adjacent to the first side of the first semiconductor material and being of a different composition than the first semiconductor material;

a third semiconductor material directly adjacent to the second side of the first semiconductor material and being of a different composition than the first semiconductor material, the first, second and a portion of the third semiconductor materials comprising a vertically-extending pillar; and

only one gate adjacent one side of the vertically-extending pillar; and

hydrogen diffused within the first, second and third semiconductor materials; the second and third semiconductor materials having substantially increased conductivity as compared to the first semiconductor material in response to the hydrogen diffused therein.

2. The integrated assembly of claim 1 wherein the substantially increased conductivity of the second and third semiconductor materials having the hydrogen therein is at least about 10-times greater than the conductivity of the first semiconductor material having the hydrogen therein.

3. The integrated assembly of claim 1 wherein the substantially increased conductivity of the second and third semiconductor materials having the hydrogen therein is at least about 100-times greater than the conductivity of the first semiconductor material having the hydrogen therein.

4. The integrated assembly of claim 1 wherein the substantially increased conductivity of the second and third semiconductor materials having the hydrogen therein is at least about 1000-times greater than the conductivity of the first semiconductor material having the hydrogen therein.

5. The integrated assembly of claim 1 wherein the second and third semiconductor materials are same composition as one another.

6. The integrated assembly of claim 1 wherein the second and third semiconductor materials are different compositions relative to one another.

7. The integrated assembly of claim 1 wherein the first, second and third semiconductor materials each comprises at least one metal in combination with one or more of oxygen, sulfur, selenium and tellurium.

8. The integrated assembly of claim 7 wherein the at least one metal is one or more of aluminum, gallium, indium, thallium, tin, cadmium and zinc.

9. The integrated assembly of claim 1 wherein the first, second and third semiconductor materials each comprises at least one element from Group 13 of the periodic table in combination with at least one element from Group 16 of the periodic table.

10. The integrated assembly of claim 1 wherein the first, second and third semiconductor materials each comprises at least one element selected from the group consisting of gallium, indium and mixtures thereof, in combination with at least one element selected from the group consisting of oxygen, sulfur, selenium, tellurium and mixtures thereof.

11. The integrated assembly of claim 1 wherein the first semiconductor material comprises GaO, and wherein the second and third semiconductor materials each comprises InGaZnO; where the chemical formulas indicate primary constituents rather than a specific stoichiometry.

12. An integrated assembly, comprising:

a first semiconductor material between two regions of a second semiconductor material; the second semiconductor material being a different composition than the first semiconductor material;

hydrogen diffused within the first semiconductor material and the second semiconductor material; the conductivity of the second semiconductor material increasing in response to the hydrogen diffused therein to thereby create a structure having the second semiconductor material as source/drain regions, and having the first semiconductor material as a channel region between the source/drain regions; and

only one vertically extending transistor gate adjacent one side of the channel region and elevationally spaced from the two regions of the second semiconductor material, the transistor gate configured to induce an electric field within the channel region.

13. The integrated assembly of claim 12 comprising a base under the first and second semiconductor materials and supporting the first and second semiconductor materials; and wherein the source/drain regions are horizontally disposed relative to one another.

14. The integrated assembly of claim 12 comprising a base under the first and second semiconductor materials and supporting the first and second semiconductor materials; and wherein the source/drain regions are vertically disposed relative to one another.

15. The integrated assembly of claim 14 wherein the transistor gate vertically overlaps at least a portion of the channel region and does not vertically overlap either of the source/drain regions.

16. The integrated assembly of claim 12 wherein:

the channel region and the source/drain regions are comprised by an access transistor;

a storage element is coupled with one of the source/drain regions and a digit line is coupled with the other of the source/drain regions;

the transistor gate is coupled with a wordline; and

the access transistor and the storage element are comprised by a memory cell.

17. The integrated assembly of claim 16 wherein the memory cell is one of many substantially identical memory cells within a memory array; wherein the wordline is one of many wordlines within the memory array; wherein the digit line is one of many digit lines within the memory array; and wherein each of the memory cells is uniquely addressed through one of the digit lines in combination with one of the wordlines.

18. The integrated assembly of claim 17 wherein the memory array is within a tier; the tier being within a vertically-stacked arrangement of tiers and being over at least one other of the tiers within the vertically-stacked arrangement.

19. The integrated assembly of claim 12 wherein the first and second semiconductor materials comprise gallium; and wherein the metal atomic percent of gallium in the first semiconductor material is greater than the metal atomic percent of gallium in the second semiconductor material.

20. The integrated assembly of claim 12 wherein the first and second semiconductor materials each comprises at least one metal in combination with one or more of oxygen, sulfur, selenium and tellurium.

21. The integrated assembly of claim 20 wherein the at least one metal is one or more of aluminum, gallium, indium, thallium, tin, cadmium and zinc.

22. The integrated assembly of claim 12 wherein the first semiconductor material comprises GaO, and wherein the second semiconductor material comprises InGaZnO; where the chemical formulas indicate primary constituents rather than a specific stoichiometry.

23. The integrated assembly of claim 1 wherein the first, second and third semiconductor materials each comprises at least one metal comprising thallium.

24. The integrated assembly of claim 1 further comprising a conductive line against and along the length of one of the second and third semiconductor materials.

25. The integrated assembly of claim 1 further comprising a digit line against and along the length of one of the second and third semiconductor materials.

26. The integrated assembly of claim 1 wherein the vertically-extending pillars comprise a square configuration in the horizontal cross section.

27. The integrated assembly of claim 12 further comprising:

a gate dielectric between the transistor gate and the channel region; and

an insulative material adjacent a side of the transistor gate opposite the gate dielectric, the gate dielectric and the insulative material comprising the same composition.

28. The integrated assembly of claim 12 further comprising:

a gate dielectric between the transistor gate and the channel region; and

an insulative material adjacent a side of the transistor gate opposite the gate dielectric, the gate dielectric and the insulative material comprising different compositions.

29. The integrated assembly of claim 12 wherein the first and second semiconductor materials each comprises at least one metal comprising thallium.

30. The integrated assembly of claim 12 further comprising a conductive line against and along the length of one of the two regions of the second semiconductor material.

31. The integrated assembly of claim 30 wherein the conductive line comprises a digit line.

32. The integrated assembly of claim 1 wherein the gate extends vertically.

33. The integrated assembly of claim 1 wherein the gate comprises a lowermost surface and the portion of the third semiconductor material comprises an uppermost surface, the lowermost surface of the gate is elevationally above the uppermost surface of the portion of the third semiconductor material.

34. The integrated assembly of claim 12 wherein the first and second semiconductor materials comprise a vertically-extending pillar, only a portion of at least one of the two regions of the second semiconductor material comprises the vertically-extending pillar.

35. The integrated assembly of claim 12 further comprising a digit line against and along the length of the bottommost one of the two regions of the second semiconductor material.