Patent Assignment
Reel/Frame 048577/0882
Assignment of Assignor's Interest
Recorded: 2019-03-12
Pages: 3
Assignors
LIAO, YU-JU
Executed: 2019-03-09
CHEN, CHIEN-FAN
Executed: 2019-03-11
WANG, CHIEN-HAO
Executed: 2019-03-09
LIN, I-CHIA
Executed: 2019-03-11
Assignee
ASE EMBEDDED ELECTRONICS INC.
NO. 10, XINJING 1ST RD., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Embedded Component Package Structure, Embedded Type Panel Substrate and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.