Merger

Recorded: 2020-04-02 Pages: 6

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Assignor

ASE EMBEDDED ELECTRONICS INC.

Executed: 2020-02-26

Assignee

ADVANCED SEMICONDUCTOR ENGINEERING, INC.

NO. 26, CHIN 3RD RD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN

Covered Properties (5)

Embedded Component Package Structure and Manufacturing Method Thereof

Patent: 10,757,813 →

Application: 16/159,264 →

Publication: US 2020/0120804

Embedded Component Package Structure, Embedded Type Panel Substrate and Manufacturing Method Thereof

Patent: 11,277,917 →

Application: 16/351,026 →

Publication: US 2020/0296836

Embedded Component Package Structure and Manufacturing Method Thereof

Patent: 11,296,030 →

Application: 16/397,530 →

Publication: US 2020/0343187

Embedded Component Package Structure and Manufacturing Method Thereof

Patent: 10,950,551 →

Application: 16/397,539 →

Publication: US 2020/0343188

Embedded Component Package Structure and Manufacturing Method Thereof

Patent: 11,139,179 →

Application: 16/565,064 →

Publication: US 2021/0074554

Related Assignments (5)

Other recorded transfers of the patents in this record — the chain of ownership.

Assignment of Assignor's Interest Oct 22, 2018

From: CHEN, CHIEN-FAN; WANG, CHIEN-HAO

To: ASE EMBEDDED ELECTRONICS INC.

Reel/Frame 047262/0711 →

Assignment of Assignor's Interest Mar 12, 2019

From: LIAO, YU-JU; CHEN, CHIEN-FAN; WANG, CHIEN-HAO; LIN, I-CHIA

To: ASE EMBEDDED ELECTRONICS INC.

Reel/Frame 048577/0882 →

Assignment of Assignor's Interest Apr 30, 2019

From: LIAO, YU-JU; CHEN, CHIEN-FAN; WANG, CHIEN-HAO

To: ASE EMBEDDED ELECTRONICS INC.

Reel/Frame 049033/0223 →

Assignment of Assignor's Interest Apr 30, 2019

From: LIAO, YU-JU; CHEN, CHIEN-FAN; WANG, CHIEN-HAO

To: ASE EMBEDDED ELECTRONICS INC.

Reel/Frame 049033/0341 →

Assignment of Assignor's Interest Sep 10, 2019

From: CHEN, CHIEN-FAN; LIAO, YU-JU

To: ASE EMBEDDED ELECTRONICS INC.

Reel/Frame 050326/0071 →