IP Library Assignment 049033/0341
Patent Assignment
Reel/Frame 049033/0341

Assignment of Assignor's Interest

Recorded: 2019-04-30 Pages: 3
Assignors
LIAO, YU-JU
Executed: 2019-04-15
CHEN, CHIEN-FAN
Executed: 2019-04-15
WANG, CHIEN-HAO
Executed: 2019-04-15
Assignee
ASE EMBEDDED ELECTRONICS INC.
NO. 10, XINJING 1ST RD., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, 811, TAIWAN
Covered Property (1)
Embedded Component Package Structure and Manufacturing Method Thereof
Application: 16/397,530 →
Publication: US 2020/0343187
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Apr 2, 2020
From: ASE EMBEDDED ELECTRONICS INC.
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 052294/0297 →