Patent Assignment
Reel/Frame 050326/0071
Assignment of Assignor's Interest
Recorded: 2019-09-10
Pages: 3
Assignee
ASE EMBEDDED ELECTRONICS INC.
NO. 10, XINJING 1ST RD., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Embedded Component Package Structure and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.