Patent Assignment
Reel/Frame 048586/0373
Assignment of Assignor's Interest
Recorded: 2019-03-13
Pages: 3
Assignor
KIM, BONG SOO
Executed: 2019-01-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.