Patent Assignment
Reel/Frame 048597/0565
Assignment of Assignor's Interest
Recorded: 2019-03-14
Pages: 4
Assignors
NAGAI, YUKI
Executed: 2019-01-11
IRINO, TETSUROH
Executed: 2019-01-18
KONDOU, YUUSUKE
Executed: 2019-01-17
FUKUDA, TOMIO
Executed: 2019-01-21
MIZUSHIMA, ETSUO
Executed: 2019-01-18
TANIGAWA, TAKAO
Executed: 2019-01-18
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition, Resin Film, Laminate, Multilayer Printed Wiring Board and Method for Producing Multilayer Printed Wiring Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 16, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056598/0546 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →