Patent Assignment
Reel/Frame 056598/0546
Change of Name
Recorded: 2021-06-16
Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition, Resin Film, Laminate, Multilayer Printed Wiring Board and Method for Producing Multilayer Printed Wiring Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 14, 2019
From: NAGAI, YUKI; IRINO, TETSUROH; KONDOU, YUUSUKE; FUKUDA, TOMIO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 048597/0565 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →