Patent Assignment
Reel/Frame 048604/0371
Assignment of Assignor's Interest
Recorded: 2019-03-14
Pages: 3
Assignors
MIN, JAE-SIK
Executed: 2019-02-27
LEE, JAE-YEOP
Executed: 2019-02-27
CHO, BYOUNG-GU
Executed: 2019-02-27
CHO, BYOUNG-CHUL
Executed: 2019-02-27
CHO, BYOUNG-KWON
Executed: 2019-02-27
Assignee
LIGHTIZER KOREA CO., LTD
#303, MEMSNANO PARTS PRODUCTION CENTER IN PUSAN NATIONAL UNIVERSITY, 2-1, BUSANDAEHAK-RO 63BEON-GIL GEUMJEONG-GU, BUSAN, 46239, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Round Chip Scale Package and Manufacturing Method Therefor
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.