IP Library Assignment 052834/0070
Patent Assignment
Reel/Frame 052834/0070

Change of Name

Recorded: 2020-06-04 Pages: 4
Assignor
LIGHTIZER KOREA CO., LTD
Executed: 2019-04-11
Assignee
LIGHTIZER CO., LTD
CHANGDUK-DONG, YONGIN TECHNO VALLEY KNOWLEDGE INDUSTRY CENTER, A907-HO, A-DONG A906-HO, 357, GUSEONG-RO, GIHEUNG-GU, YONGINSI, GYEONGGI-DO, 16914, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property (1)
Round Chip Scale Package and Manufacturing Method Therefor
Application: 16/333,584 →
Publication: US 2019/0259921
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 14, 2019
From: MIN, JAE-SIK; LEE, JAE-YEOP; CHO, BYOUNG-GU; CHO, BYOUNG-CHUL
To: LIGHTIZER KOREA CO., LTD
Reel/Frame 048604/0371 →
Assignment of Assignor's Interest Nov 8, 2024
From: LIGHTIZER CO., LTD.
To: AGASEMICON CORP.
Reel/Frame 069210/0956 →