Patent Assignment
Reel/Frame 048604/0907
Assignment of Assignor's Interest
Recorded: 2019-03-15
Pages: 4
Assignors
LIU, ZI-JHENG
Executed: 2019-03-11
KUO, HUNG-JUI
Executed: 2019-03-11
LEE, MING-TAN
Executed: 2019-03-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure and Method of Manufacturing the Same